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TC2054 查看數據表(PDF) - Microchip Technology

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TC2054 Datasheet PDF : 22 Pages
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TC2054/2055/2186
ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Specifications: Unless otherwise noted, VIN = VR + 1V, IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C.
BOLDFACE type specifications apply for junction temperature of -40°C to +125°C.
Parameter
Sym
Min
Typ
Max Units
Conditions
Thermal Regulation
Thermal Shutdown Die
Temperature
ΔVOUT/ΔPD
TSD
0.04
160
V/W Note 8
°C
Output Noise
eN
600
nV / IL = IOUTMAX, F = 10 kHz
Hz
Response Time
(from Shutdown Mode)
SHDN Input
tR
60
µs VIN = 4V
CIN = 1 µF, COUT = 10 µF
IL = 0.1 mA, Note 11
SHDN Input High Threshold
VIH
60
%VIN VIN = 2.5V to 6.0V
SHDN Input Low Threshold
VIL
15
%VIN VIN = 2.5V to 6.0V
ERROR OUTPUT
Minimum VIN Operating
VINMIN
1.0
Voltage
V IOL = 0.1 mA
Output Logic Low Voltage
VOL
ERROR Threshold Voltage
ERROR Positive Hysteresis
VOUT to ERROR Delay
Resistance from ERROR to
GND
VTH
VHYS
tDELAY
RERROR
400
0.95 x VR
50
2
126
mV 1 mA Flows to ERROR,
IOL = 1 mA, VIN = 2V
V See Figure 4-2
mV Note 10
ms VOUT from VR = 3V to 2.8V
Ω VDD = 2.5V, VOUT = 2.5V
Note 1:
2:
3:
4:
5:
The minimum VIN has to meet two conditions: VIN = 2.7V and VIN = VR + VDROPOUT.
VR is the regulator output voltage setting. For example: VR = 1.8V, 2.7V, 2.8V, 2.85V, 3.0V, 3.3V.
TCVOUT =
(---V----O-----U-----T----M------A----X------–----V----O------U----T----M------I--N-----)---×-----1----0---6--
VOUT × ΔT
6: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 1.0 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
7: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal
value at a 1V differential.
8: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to IMAX at VIN = 6V for T = 10 ms.
9: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction tem-
perature and the thermal resistance from junction-to-air (i.e. TA, TJ, θJA).
10: Hysteresis voltage is referenced by VR.
11: Time required for VOUT to reach 95% of VR (output voltage setting), after VSHDN is switched from 0 to VIN.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, VDD = +2.7V to +6.0V and VSS = GND.
Parameters
Sym
Min
Typ
Max
Temperature Ranges:
Extended Temperature Range
Operating Temperature Range
Storage Temperature Range
Thermal Package Resistances:
Thermal Resistance, 5L-SOT-23
TA
-40
+125
TA
-40
+125
TA
-65
+150
θJA
255
Units
°C
°C
°C
°C/W
Conditions
DS21663D-page 4
© 2009 Microchip Technology Inc.

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