LX1673 查看數據表（PDF） - Microsemi Corporation
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LX1673 Datasheet PDF : 13 Pages
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LX1673
TM
®
High Frequency PWM Regulator
PRODUCTION DATA SHEET
ABSOLUTE MAXIMUM RATINGS
Supply Voltage (VCC) DC ................................................................-0.3V to 5.5V
Supply Voltage (VCC) Transient .........................................................-0.3V to 6V
Driver Supply Voltage (VCCL) DC .....................................................-0.3V to 13V
Driver Supply Voltage (VCCL) Transient............................................-0.3V to 16V
Driver Supply Voltage (VC1) DC .......................................................-0.3V to 19V
Input Voltage (SS/DIS) .....................................................................-0.3V to 5.5V
Output Drive Peak Current Source (HO, LO).......................................1A (500ns)
Output Drive Peak Current Sink (HO, LO) ..........................................1A (500ns)
Operating Temperature Range .........................................................-40°C to 85°C
Maximum Operating Junction Temperature ................................................ 150°C
Storage Temperature Range...........................................................-65°C to 150°C
Lead Temperature (Soldering 180 seconds) ................................................ 235°C
Package Peak Temp. for Solder Reflow (40 Seconds Maximum Exposure).. 260°C(+0, -5)
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal.
The limitation on transient time is thermal and is due to zener diodes on the supply
pins, application of maximum voltages will increase current into that pin and
increase package power dissipation.
THERMAL DATA
PW Plastic TSSOP 20-Pin
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
90°C/W
LQ Plastic MLPQ 20-Pin
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
35°C/W
Junction Temperature Calculation: TJ = TA + (PD x θJC).
The θJA numbers are guidelines for the thermal performance of the device/pc-board system.
All of the above assume no airflow.
PACKAGE PIN OUT
LDGD 1
LDFB
LDDIS
DGND
AGND
6
16
BDRV
VCCL
VCC
VS
11 CS
LQ PACKAGE
(Top View)
N.C. – No Internal Connection
N/U – Not Used
RSVD – Do Not Use
VC1
1
PGOOD
LDOVCC
LDGD
LDFB
LDDIS
DGND
AGND
DIS
SS
10
20
TDRV
PGND
BDRV
VCCL
VCC
VS
CS
EAO
EA-
11
EA+
PW PACKAGE
(Top View)
Pb-free 100% Matte Tin Lead Finish
Copyright © 2004
Rev 1.0, 3/18/2005
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
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