MA4E2502M-1246W 查看數據表（PDF） - Tyco Electronics
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MA4E2502M-1246W Datasheet PDF : 4 Pages
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SURMOUNTTM Low, Medium and High
Barrier Silicon Schottky Diodes
MA4E2502 Series
V5
Electrical Specifications @ 25 °C
Model
Number
Type
Recommended Vf @ 1 mA
Frequency Range ( mV )
MA4E2502L
MA4E2502M
MA4E2502H
Low
Barrier
Medium
Barrier
High
Barrier
DC - 18 GHz
DC - 18 GHz
DC - 18 GHz
330 Max
300 Typ
470 Max
420 Typ
700 Max
650 Typ
Vb @ 10 uA Ct @ 0V
(V)
( pF )
3 Min
5 Typ
3 Min
5 Typ
3 Min
5 Typ
0.12 Max
0.10 Typ
0.12 Max
0.10 Typ
0.12 Max
0.10 Typ
Rt Slope Resistance
( Vf1 - Vf2 )/(10.5mA-9.5mA )
(Ω)
16 Typ
20 Max
12 Typ
18 Max
11 Typ
15 Max
Rt is the dynamic slope resistance where
Rt = Rs + Rj, where Rj = 26 / Idc (Idc is in mA)
Handling
All semiconductor chips should be handled with care
to avoid damage or contamination from perspiration
and skin oils. The use of plastic tipped tweezers or
vacuum pickups is strongly recommended for
individual components. The top surface of the die
has a protective polyimide coating to minimize
damage.
The rugged construction of these SurMount devices
allows the use of standard handling and die attach
techniques. It is important to note that industry
standard electrostatic discharge (ESD) control is
required at all times, due to the sensitive nature of
Schottky junctions.
Bulk handling should insure that abrasion and
mechanical shock are minimized.
Absolute Maximum Ratings @ 25 °C
(Unless Otherwise Noted) 1
Parameter
Absolute Maximum
Operating Temperature
-40 °C to +125 °C
Storage Temperature
-40 °C to +150 °C
Junction Temperature
+175 °C
Forward Current
20 mA
Reverse Voltage
5V
RF C.W. Incident Power
+ 20 dBm
RF & DC Dissipated Power
50 mW
1. Operation of this device above any one of these parameters
may cause permanent damage.
2
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
Die Bonding
Die attach for these devices is made simple through
the use of surface mount die attach technology.
Mounting pads are conveniently located on the
bottom surface of these devices, and are opposite
the active junction. The devices are well suited for
high temperature solder attachment onto hard
substrates. 80Au/20Sn and Sn63/Pb37 solders are
acceptable for usage. Die attach with Electrically
Conductive Silver Epoxy is Not Recommended.
For Hard substrates, we recommend utilizing a
vacuum tip and force of 60 to 100 grams applied
uniformly to the top surface of the device, using a
hot gas bonder with equal heat applied across the
bottom mounting pads of the device. When soldering
to soft substrates, it is recommended to use a
lead-tin interface at the circuit board mounting pads.
Position the die so that its mounting pads are
aligned with the circuit board mounting pads. Reflow
the solder paste by applying Equal heat to the circuit
at both die-mounting pads. The solder joint must Not
be made one at a time, creating un-equal heat flow
and thermal stress. Solder reflow should Not be
performed by causing heat to flow through the top
surface of the die. Since the HMIC glass is
transparent, the edges of the mounting pads can be
visually inspected through the die after die attach is
completed.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
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