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MAX3793(2004) 查看數據表(PDF) - Maxim Integrated

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MAX3793 Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
1Gbps to 4.25Gbps Multirate Transimpedance
Amplifier with Photocurrent Monitor
If the amount of tolerable noise is known, the filter
capacitor can be easily selected:
CFILT = (VNOISE x CIN) / (RFILT x INOISE)
For example, with maximum noise voltage = 100mVP-P,
CIN = 0.6pF, RFILT = 750, and INOISE at 350nA, the
filter capacitor is:
CFILT = (100mV x 0.6pF) / (750x 350nA) = 229pF
Select RMON
If photocurrent monitoring is desired, connect a resistor
between MON and ground to monitor the average pho-
tocurrent. Select the largest RMON possible:
5-PIN HEADER
MON
OUT-
PHOTODIODE
CFILT
VCC
CVCC
OUT+
RMON = 2.0V
IMONMAX
where, IMONMAX is the largest average input current
observed. An ammeter can also be used to monitor the
current out of the MON pin.
Layout Considerations
Figure 3 shows suggested layouts for 4-pin and 5-pin
TO headers.
Wire Bonding
For high-current density and reliable operation, the
MAX3793 uses gold metalization. For best results, use
gold-wire ball-bonding techniques. Exercise caution if
attempting wedge bonding. The die size is 30 mils x 50
mils (0.762mm x 1.27mm), and the die thickness is 15
mils (380µm). Bond-pad size for the VCC, GND, OUT+,
and OUT- pads is 94µm x 94µm. Bond-pad size for the
FILT, IN, and MON pads is 79µm x 79µm; all bond-pad
metal thickness is 1.2µm. Refer to Maxim Application
Note HFAN-08.0.1: Understanding Bonding Coordinates
and Physical Die Size for additional information on bond-
pad coordinates. Recommended bonding sequence is
shown in Figure 4.
MAX3793
PHOTODIODE IS MOUNTED
ON CFILT, CASE IS GROUND.
4-PIN HEADER
PHOTODIODE
CFILT
VCC
CVCC
OUT-
OUT+
11
3
9
CFILT
1
10
7
CVCC
2
5
6
8
4
MAX3793
PHOTODIODE IS MOUNTED
ON CFILT, CASE IS GROUND.
MAX3793
Figure 3. Suggested TO Header Layouts
Figure 4. Recommended MAX3793 Bonding Scheme
8 _______________________________________________________________________________________

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