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MAX4684ETB 查看數據表(PDF) - Maxim Integrated

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MAX4684ETB Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
0.5Ω/0.8Ω Low-Voltage, Dual SPDT
Analog Switches in UCSP
ABSOLUTE MAXIMUM RATINGS
(All Voltages Referenced to GND)
V+, IN_......................................................................-0.3V to +6V
Continuous Power Dissipation (TA = +70°C)
10-Pin TDFN (derate 18.5mW/°C above +70°C)........1482mW
COM_, NO_, NC_ (Note1) ........................... -0.3V to (V+ + 0.3V)
Continuous Current NO_, NC_, COM_ .......................... ±300mA
12-Bump UCSP (derate 11.4mW/°C above +70°C) ...909mW
10-Pin µMAX (derate 5.6mW/°C above +70°C) ..........444mW
Peak Current NO_, NC_, COM_
Operating Temperature Ranges..........................-40°C to +85°C
(pulsed at 1ms, 50% duty cycle).................................±400mA
Peak Current NO_, NC_, COM_
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
(pulsed at 1ms, 10% duty cycle).................................±500mA
Bump Temperature (soldering) (Note 2)
Infared (15s)................................................................+220°C
Vapor Phase (60s) ......................................................+215°C
Note 1: Signals on NO_, NC_, and COM_ exceeding V+ or GND are clamped by internal diodes. Limit forward-diode current to
maximum current rating.
Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recom-
mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection reflow. Pre-
heating is required. Hand or wave soldering is not allowed.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS—+3V SUPPLY
(V+ = +2.7V to +3.3V, VIH = +1.4V, VIL = +0.5V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at +3V and +25°C.)
(Notes 3, 9, 10)
PARAMETER
ANALOG SWITCH
Analog Signal Range
NC_ On-Resistance
(Note 4)
NO_ On-Resistance
(Note 4)
SYMBOL
CONDITIONS
TA
MIN
VNO_, VNC_,
VCOM_
E
0
RON(NC)
V+ = 2.7V; ICOM_ = 100mA;
VNC_ = 0 to V+
MAX4684
MAX4685
+25°C
E
+25°C
E
RON(NO)
V+ = 2.7V; ICOM_ = 100mA;
VNO_ = 0 to V+
+25°C
E
TYP MAX UNITS
V+
V
0.3
0.5
0.5
Ω
0.45 0.8
0.8
0.45 0.8
Ω
0.8
On-Resistance Match
Between Channels
(Notes 4, 5)
ΔRON
V+ = 2.7V; ICOM_ = 100mA;
VNO_ or VNC_ = 1.5V
+25°C
E
NC_ On-Resistance
Flatness (Note 6)
RFLAT (NC)
V+ = 2.7V; ICOM = 100mA; MAX4684
VNC_ = 0 to V+
MAX4685
E
E
NO_ On-Resistance
Flatness (Note 6)
RFLAT (NO)
V+ = 2.7V; ICOM = 100mA;
VNO_ = 0 to V+
E
NO_ or NC_ Off-
Leakage Current
(Note 7)
+25°C
-1
INO_(OFF) or V+ = 3.3V; VNO_ or VNC_ = 3V, 0.3V;
INC_(OFF) VCOM_ = 0.3V, 3V
E
-10
0.06
Ω
0.06
0.15
Ω
0.35
0.35
Ω
1
nA
10
COM_ On-Leakage
Current (Note 7)
V+ = 3.3V; VNO_ or VNC_ = 3V, 0.3V, or +25°C
-2
ICOM_(ON)
unconnected; VCOM_ = 3V, 0.3V, or
unconnected
E
-20
2
nA
20
DYNAMIC CHARACTERISTICS
Turn-On Time
tON
V+ = 2.7V, VNO_ or VNC_ = 1.5V;
RL = 50Ω; CL = 35pF; Figure 2
+25°C
E
30
50
ns
60
2 _______________________________________________________________________________________

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