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MAX4995ALAUT

50mA to 600mA Programmable Current-Limit Switches

Maxim Integrated 

50mA to 600mA Programmable

Current-Limit Switches

ABSOLUTE MAXIMUM RATINGS

IN, ON, ON, FLAG, OUT, and SETI to GND .............-0.3V to +6V

Current into Any Pin (Except IN, OUT)................................20mA

OUT Short Circuit to GND .................................................800mA

Continuous Power Dissipation (TA = +70°C) (Note 1)

10-Pin UTQFN (derate 6.99mW/ °C above TA = +70°C) ..559mW

6-Pin SOT23 (derate 13.4mW/ °C above TA = +70°C)...1072.4mW

8-Pin TDFN (derate 11.9mW/ °C above TA = +70°C) ....953.5mW

Junction-to-Ambient Thermal Resistance (θJA)

(Note 2).....................................................................143.1°C/W

Operating Temperature Range .........................-40°C to +125°C

Storage Temperature Range .............................-65°C to +150°C

Junction Temperature ......................................................+150°C

Lead Temperature (soldering, 10s) .................................+300°C

Note 1: These power limits are defined by the thermal characteristics of the package, maximum function temperature (+150°C), and

the JEDEC51-7 defined setup. Maximum power dissipation could be lower, limited by the thermal-shutdown protection

included in this IC.

Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

ELECTRICAL CHARACTERISTICS

(VIN = +1.7V to +5.5V, RSETI = 94.3kΩ, CIN = 1µF, and TA = TJ = -40°C to +125°C, unless otherwise noted. Typical values are at VIN = +3.3V,

TA = +25°C.)

PARAMETER

SYMBOL

CONDITIONS

MIN TYP MAX UNITS

SUPPLY OPERATION

Operating Voltage

Quiescent Current

Latchoff Current

VIN

IQ

ILATCH

IOUT = 0, switch on, VIN = 3.3V

VIN = 3.3V, IOUT = 0 after an overcurrent

fault (MAX4995B)

1.7

5.5

V

170 300

μA

8

15

μA

Shutdown Forward Current

Shutdown Reverse Current

INTERNAL FET

Switch-On Resistance

Normalized Current-Limit Accuracy

ISHDN

IRSHDN

VON = 0, VON = VIN, VIN = 5.5V, VOUT = 0

VON = 0, VON = VIN, VIN = 1.7V,

VOUT = 5.5V (current into OUT)

RON

VIN = 3.3V, IOUT lower than ILIM

ILIM = 50mA to 600mA, VIN - VOUT = 1V,

VIN = 3.3V (Note 3)

0.01

5

μA

0.01

1

μA

130 350 m

0.9

1

1.1

—

(RSETI + 2.48) x ILIM Product

ILIM = 50mA to 600mA, VIN - VOUT = 1V,

VIN = 3.3V

26138 29042 31946 V

Reverse Blocking Current

VOUT > VIN + 300mV after reverse-current-

limit shutdown

10

μA

Reverse Blocking Threshold

VOUT = VIN + 300mV, OUT falling until switch

turns on

35

110 210

mV

FLAG Assertion Drop Voltage

Threshold

ON, ON INPUT

ON, ON Input Leakage

ON, ON Input Logic-High Voltage

ON, ON Input Logic-Low Voltage

VFA

Increase (VIN - VOUT) drop until FLAG

asserts, IOUT limiting, VIN = 3.3V

ILEAK

VIH

VIL

VON, VON = VIN or GND

650

mV

-1

+1

μA

1.6

V

0.4

V

2 _______________________________________________________________________________________

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