MAX6900ETT 查看數據表（PDF） - Maxim Integrated

零件编号

产品描述 (功能)

生产厂家

MAX6900ETT

PLASTIC ENCAPSULATED DEVICES

Maxim Integrated 

II. Manufacturing Information

A. Description/Function:

I2C-Bus-Compatible Real-Time Clock

B. Process:

TC05

C. Number of Device Transistors:

19,307

D. Fabrication Location:

Taiwan

E. Assembly Location:

Malaysia

F. Date of Initial Production:

January, 2001

III. Packaging Information

A. Package Type:

6-Lead QFN (3x3)

B. Lead Frame:

Copper

C. Lead Finish:

Solder Plate

D. Die Attach:

Silver-Filled Epoxy

E. Bondwire:

Gold (1 mil dia.)

F. Mold Material:

Epoxy with silica filler

G. Assembly Diagram:

Buildsheet # 05-9000-0530

H. Flammability Rating:

Class UL94-V0

I. Classification of Moisture Sensitivity

per JEDEC standard JESD22-A112: Level 1

IV. Die Information

A. Dimensions:

70 x 44 mils

B. Passivation:

C. Interconnect:

Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)

Al/Si/Cu (Aluminum/ Silicon/ Copper)

D. Backside Metallization:

None

E. Minimum Metal Width:

Metal 1: 0.9 microns; Metal 2: 0.9 microns (as drawn)

F. Minimum Metal Spacing:

Metal 1: 0.8 microns; Metal 2: 0.8 microns (as drawn)

G. Bondpad Dimensions:

5 mil. Sq.

H. Isolation Dielectric:

I. Die Separation Method:

SiO2

Wafer Saw

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