MAX9775(2008) 查看數據表（PDF） - Maxim Integrated

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MAX9775
(Rev.:2008)

2 x 1.5W, Stereo Class D Audio Subsystem with DirectDrive Headphone Amplifier

Maxim Integrated 

2 x 1.5W, Stereo Class D Audio Subsystem

with DirectDrive Headphone Amplifier

ELECTRICAL CHARACTERISTICS (continued)

(VDD = PVDD = CPVDD = 3.3V, VGND = VPGND = VCPGND = 0V, SHDN = VDD, I2C settings (INA gain = +20dB, INB gain = INC gain =

0dB, volume setting = 0dB, mono path gain = 0dB, SHDN = 1, SSM = 1). Speaker load resistors (RLSP) are terminated between

OUT_+ and OUT_-, headphone load resistors are terminated to GND, unless otherwise noted. C1 = C2 = C3 = 1µF. TA = TMIN to

TMAX, unless otherwise noted. Typical values are at TA = +25°C.) (Note 1)

PARAMETER

SYMBOL

SDA, SCL Input Capacitance

CIN

Input Leakage Current

IIN

Pulse Width of Spike Suppressed

tSP

DIGITAL OUTPUTS (SDA Open Drain)

Output Low Voltage SDA

VOL

Output Fall Time SDA

I2C INTERFACE TIMING (Note 7)

Serial Clock Frequency

Bus Free Time Between STOP

and START Conditions

tOF

fSCL

tBUF

CONDITIONS

ISINK = 6mA

VH(MIN) to VL(MAX) bus capacitance =

10pF to 400pF, ISINK = 3mA

MIN TYP MAX UNITS

10

pF

0.3

5.0

µA

50

ns

0.4

V

250

ns

DC

400

kHz

1.3

µs

START Condition Hold

STOP Condition Setup Time

Clock Low Period

Clock High Period

Data Setup Time

Data Hold Time

Maximum Receive SCL/SDA Rise

Time

tHD:STA

tSU:STA

tLOW

tHIGH

tSU:DAT

tHD:DAT

tR

0.6

µs

0.6

µs

1.3

µs

0.6

µs

100

ns

0

900

ns

300

ns

Maximum Receive SCL/SDA Fall

Time

tF

300

ns

Setup Time for STOP Condition

Capacitive Load for Each Bus

Line

tSU:STO

Cb

0.6

µs

400

pF

Note 1: All devices are 100% production tested at room temperature. All temperature limits are guaranteed by design.

Note 2: Measured at headphone outputs.

Note 3: Amplifier inputs AC-coupled to GND.

Note 4: Testing performed with a resistive load in series with an inductor to simulate an actual speaker load. For RL = 8Ω, L = 68µH;

for RL = 4Ω, L = 47µH.

Note 5: MAX9775 only.

Note 6: Testing performed at room temperature with an 8Ω resistive load in series with a 68µH inductive load connected across BTL

outputs for speaker amplifier. Testing performed with a 32Ω resistive load connected between OUT_ and GND for head-

phone amplifier. Testing performed with 32Ω resistive load connected between OUTRx and GND for mono receiver amplifi-

er. Mode transitions are controlled by I2C.

Note 7: Guaranteed by design.

6 _______________________________________________________________________________________

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