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MAX9779 查看數據表(PDF) - Maxim Integrated

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MAX9779 Datasheet PDF : 19 Pages
First Prev 11 12 13 14 15 16 17 18 19
2.6W Stereo Audio Power Amplifier and
DirectDrive Headphone Amplifier
For example, when compared to a 0trace, a 100m
trace reduces the power delivered to a 4load from
2.1W to 2W. Large output, supply, and GND traces also
improve the power dissipation of the device.
The MAX9779 thin QFN package features an exposed
thermal pad on its underside. This pad lowers the
package’s thermal resistance by providing a direct
heat-conduction path from the die to the PC board.
Connect the exposed thermal pad to GND by using a
large pad and multiple vias to the GND plane.
LEFT-CHANNEL
AUDIO INPUT
CIN
1µF
INL 1
4.5V TO 5.5V
0.1µF
MAX9779
GAIN/
CONTROL
VDD
25
6, 16 PVDD
BTL
AMPLIFIER
4 OUTL+
5 OUTL-
Block Diagram
4.5V TO 5.5V
0.1µF
RIGHT-CHANNEL
AUDIO INPUT
CIN
1µF
INR 27
GAIN/
CONTROL
CBIAS
1µF
3V TO 5.5V
1µF
BIAS 21
GND 28
VDDGAIN1 24
VDD GAIN2 23
N.C. 2
VDD SHDN 22
CPVDD 7
GAIN
HEADPHONE
DETECTION
SHUTDOWN
CONTROL
C1P 8
C1
1µF
C1N 10
CPGND 9
CHARGE
PUMP
11
12
CPVSS
VSS
C2
1µF
BTL
AMPLIFIER
26
3, 19
GND
PGND
18 OUTR+
17 OUTR-
15 HPVDD
20 HPS
14 HPOUTL
13 HPOUTR
3V TO 5.5V
10µF
16 ______________________________________________________________________________________

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