MBRB3030CTL 查看數據表（PDF） - ON Semiconductor
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MBRB3030CTL Datasheet PDF : 8 Pages
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MBRB3030CTL
THERMAL CHARACTERISTICS (All device data is “Per Leg” except where noted.)
Characteristic
Thermal Resistance, Junction−to−Ambient (Note 1)
Thermal Resistance, Junction−to−Case
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 2)
(IF = 15 A, TJ = 25°C)
(IF = 30 A, TJ = 25°C)
Maximum Instantaneous Reverse Current (Note 2)
(Rated VR, TJ = 25°C)
(Rated VR, TJ = 125°C)
1. Mounted using minimum recommended pad size on FR−4 board.
2. Pulse Test: Pulse Width = 250 ms, Duty Cycle ≤ 2.0%.
Symbol
RqJA
RqJC
VF
IR
Value
50
1.0
0.44
0.51
2.0
195
Unit
°C/W
°C/W
V
mA
1000
1000
100
TJ = 125°C
10
75°C
1.0
25°C
100
TJ = 125°C
10
75°C
1.0
25°C
0.1
0.1
0.3
0.5
0.7
0.9
1.1
VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
0.1
0.1
0.3
0.5
0.7
0.9
1.1
VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
Figure 2. Maximum Forward Voltage
1.0E+0
1.0E−1
1.0E−2
1.0E−3
1.0E−4
TJ = 125°C
75°C
25°C
1.0E−5
0
5.0
10
15
20
25
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Reverse Current
1.0E+0
1.0E−1
1.0E−2
TJ = 125°C
75°C
1.0E−3
25°C
1.0E−4
1.0E−5
30
0
5.0
10
15
20
25
30
VR, REVERSE VOLTAGE (VOLTS)
Figure 4. Maximum Reverse Current
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