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MC-7846 查看數據表(PDF) - NEC => Renesas Technology

零件编号
产品描述 (功能)
生产厂家
MC-7846
NEC
NEC => Renesas Technology NEC
MC-7846 Datasheet PDF : 2 Pages
1 2
MC-7845, 7846, 7847
ELECTRICAL CHARACTERISTICS, cont. (TA = 30±5 °C, VDD = 24 V, ZS = ZL = 75 )
SYMBOLS
IDD
CTB
XMod
CSO
PART NUMBER
CHARACTERISTICS
Operating Current
Composite Triple Beat
Cross Modulation1
Composite Second Order
UNITS
mA
dBc
dBc
dBc
MC-7845
MIN TYP MAX
275 – 375
– -63 -60
– -59 -55
– -68 -63
MC-7846
MIN TYP MAX
275 – 375
– -63 -60
– -60 -55
– -67 -63
MC-7847
MIN TYP MAX
275 – 375
– -65 -60
– -62 -55
– -67 -63
TEST CONDITIONS
RF OFF
110 Channels,
VOUT = 50 dBmV at
745.25 MHz, 10 dB tilted
across the band
1. Measured per US standard methods and procedures (using selective level meter).
ABSOLUTE
MAXIMUM RATINGS1 (TCASE= 30 °C)
SYMBOLS
VDD
VI
TC
TSTG
PARAMETERS
UNITS RATINGS
Supply Voltage
V
30
Input Voltage (Single Tone)2 dBmV
65
Operating Case Temperature °C -30 to +100
Storage Temperature
°C -40 to +100
Note:
1. Operation in excess of any one of these parameters may result
in permanent damage.
2. Maximum single channel power applied to the input for 1 minute
with no measurable degradation in performance.
RECOMMENDED
OPERATING CONDITIONS (Zs = ZL = 75)
SYMBOLS
PARAMETERS UNITS MIN TYP MAX
VDD Supply VoltageV
23.5 24.0 24.5
Vi
Input Voltage1, MC-7845 dBmV – 36.0 39.0
MC-7846
– 32.0 35.0
MC-7847
– 29.0 32.0
TC Operating Case
Temperature
°C -30 +25 +85
Note:
1. Test Conditions: 110 Channels, 10 dB tilted across the band.
ORDERING INFORMATION
PART NUMBER
PACKAGE
QUANTITY
MC-7845
7-pin special with heatsink 50pcs max/ Tray
MC-7846
7-pin special with heatsink 50pcs max/ Tray
MC-7847
7-pin special with heatsink 50pcs max/ Tray
NOTES ON CORRECT USE
1. The space between PC board and root of the lead should be
kept more than 1 mm to prevent undesired stress on the lead and
also should be kept less than 4 mm to prevent undesired parasitic
inductance.
Recommended space is 2.0 to 3.0 mm typical.
2. Recommended torque strength of the screw is 59 to 78 Ncm.
3. Form the ground pattern as wide as possible to minimize ground
impedance. (to prevent undesired oscillation)
All the ground pins must be connected together with wide ground
pattern to decrease impedance difference.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended
conditions. Other soldering methods and conditions than the
recommended conditions are to be consulted with our sales
representatives.
Soldering
Method
Soldering
Conditions
Condition
Symbol
Pin Part Heating Pin area temperature: less
than 260°C1
Hour: Within 2 sec./pin
Note.
1. The point of pin part heating must be kept at a distance of more
than 1.2 mm from the root of lead.
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
07/08/2003

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