MC10H645 查看數據表（PDF） - ON Semiconductor

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MC10H645

1:9 TTL Clock Driver

ON Semiconductor 

MC10H645

Table 7. AC CHARACTERISTICS (VT = VE = 5.0 V ±5%)

Symbol

Characteristic

tPLH

tPLH

tPHL

tskpp

tskwd*

tPLH

Propagation Delay

D0 to Output Only

Propagation Delay

D1 to Output

Propagation Delay

D0 to Output

D1 to Output

Part−to−Part Skew

D0 to Output Only

Within−Device Skew

D0 to Output Only

Propagation Delay

SEL to Q

tr

Output Rise/Fall Time

tf

0.8V to 2.0V

tS

Setup Time

SEL to D

0°C

25°C

85°C

Min Max Min Max Min Max

Q0−Q8 4.8 5.8 4.8 5.8 5.2 6.2

Unit

ns

Condition

CL = 50 pF

4.8 5.8 4.8 5.8 5.2 6.2 ns

ns

4.8 5.8 4.8 5.8 5.2 6.2

4.8 5.8 4.8 5.8 5.2 6.2

1.0

1.0

1.0 ns

0.65

0.65

0.65 ns

Q0−Q8 4.5 6.5 5.0 7.0 5.2 7.2 ns CL = 50 pF

Q0−Q8 0.5 2.5 0.5 2.5 0.5 2.5 ns CL = 50 pF

0.5 2.5 0.5 2.5 0.5 2.5

ns

1.0

1.0

1.0

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared

operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit

values are applied individually under normal operating conditions and not valid simultaneously.

*Within−Device Skew defined as identical transitions on similar paths through a device.

Table 8. DUTY CYCLE SPECIFICATIONS (0°C ≤ TA ≤ 85°C; Duty Cycle Measured Relative to 1.5 V)

Symbol

Characteristic

Min

Nom

Max

Unit

Condition

PW

Range of VCC and CL to Meet Min Pulse

VCC

4.875

5.0

5.125

V All Outputs

Width (HIGH or LOW) at fout ≤50MHz

CL

10.0

50.0

pF

PW

9.0

11.0

ns

ORDERING INFORMATION

Device

Package

Shipping†

MC10H645FN

PLCC−28

37 Units / Rail

MC10H645FNG

PLCC−28

(Pb−Free)

37 Units / Rail

MC10H645FNR2

PLCC−28

500 / Tape & Reel

MC10H645FNR2G

PLCC−28

(Pb−Free)

500 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

http://onsemi.com

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