MC33999 查看數據表（PDF） - Motorola => Freescale
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MC33999 Datasheet PDF : 16 Pages
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Freescale Semiconductor, Inc.
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
VPWR Supply Voltage (Note 1)
VPWR
-1.5 to 50
V
SPI Interface Logic Supply Voltage (Note 1)
SOPWR
-0.3 to 7.0
V
SPI Interface Logic Input Voltage (CS, PWM, SI, SO, SCLK, RST, PWMn)
VIN
(Note 1)
-0.3 to 7.0
V
Output Drain Voltage
VDS
-0.3 to 45
V
Frequency of SPI Operation (Note 2)
fSPI
6.0
MHz
Output Clamp Energy (Note 3)
ECLAMP
50
mJ
ESD Voltage (Note 4)
Human Body Model (Note 5)
Machine Model (Note 6)
VESD1
VESD2
V
±2000
±200
Storage Temperature
TSTG
-55 to 150
°C
Operating Case Temperature
TC
-40 to 125
°C
Operating Junction Temperature
TJ
-40 to 150
°C
Power Dissipation (TA = 25°C) (Note 7)
PD
2.0
W
Lead Soldering Temperature (Note 8)
TSOLDER
260
°C
Thermal Resistance
Junction-to-Ambient (Note 9)
Junction-to-Case (Note 10)
Junction-to-Board
RθJA
RθJC
RθJB
°C/ W
60
1.2
8.0
Notes
1. Exceeding these limits may cause malfunction or permanent damage to the device.
2. This parameter is guaranteed by design but not production tested.
3. Maximum output clamp energy capability at 150°C junction temperature using single non-repetitive pulse method.
4. ESD data is available upon request.
5. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω).
6. ESD2 testing is performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω).
7. Maximum power dissipation with no heat sink used.
8. Lead soldering temperature limit is for 10 seconds maximum duration. Not designed of immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
9. Tested per JEDEC test JESD52-2 (single-layer PWB).
10. Tested per JEDEC test JESD51-8 (two-layer PWB).
33999
4
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