98ASB42564B 查看數據表（PDF） - Freescale Semiconductor
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98ASB42564B Datasheet PDF : 11 Pages
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Table 1. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Rating
Symbol
Value
Unit
ELECTRICAL RATINGS
Peak VPWR Voltage
Double Battery
1 Minute Maximum TA = 30°C
ESD Voltage
Human Body Model (CZAP = 100 pF, RZAP = 1500 W)
Machine Model (CZAP = 200 pF, RZAP = 0 W)
Charge Device Model (CDM), Robotic (CZAP = 4.0pF)
THERMAL RATINGS
Storage Temperature
Operating Ambient Temperature
Operating Junction Temperature
Thermal Resistance
Junction-to-Ambient (1)
Junction-to-Case (2)
Junction-to-Board (3)
Soldering Temperature (4)
VPWRPK
VDBLBAT
VESD
TSTG
TA
TJ
RθJA
RθJC
RθJB
40
26.5
± 2000
± 200
± 1200
-55 to 150
-0 to 110
-0 to 150
41
0.2
3.0
V
V
V
°C
°C
°C
°C/W
Notes
1. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance. In accordance with SEMI G38-
87 and JEDEC JESD51-2 with the single layer board horizontal.
2. Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MILSPEC 883
Method 1012.1) with the cold plate temperature used for the case temperature.
3. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface
of the board near the package.
4. Terminal soldering temperature limit is for 10 seconds maximum duration. The device is not designed for immersion soldering. Exceeding
these limits may cause malfunction or permanent damage to the device.
Sensors
Freescale Semiconductor
MC33941
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