MC34700EP 查看數據表（PDF） - Freescale Semiconductor

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MC34700EP

9.0 to 18 V, Quad Output, Integrated MOSFET Power Supply

Freescale Semiconductor 

ELECTRICAL CHARACTERISTICS

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

ABSOLUTE MAXIMUM RATINGS

Table 1. Maximum Ratings

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device. This is a stress only rating and operation at these or any other conditions above those indicated

in the operational sections of this specification is not implied.

Ratings

Symbol

Value

Unit

ELECTRICAL RATINGS

Input Voltages

V

Input Voltage

Input DC/DC1 Voltage, IVIN = 0

Input DC/DC2, 3, and LDO Voltage

VIN

VIN1

VIN2, VIN3,

VINLDO

-0.3 to 20

-0.3 to 20

-0.3 to 7

Switch Node Voltages

V

Switch Node DC/DC1

Switch Node DC/DC2, DC/DC3

VSW1

VSW2, VSW3

-0.3 to 20

-0.3 to 7

Bootstrap Voltages

V

Bootstrap DC/DC1

Bootstrap DC/DC2, DC/DC3

Bootstrap Voltage Referenced to Switch Node Voltage

VBST1

VBST2, VBST3

VBST - VSW

-0.3 to 25

-0.3 to 14

-0.3 to 7

Compensation (COMP1, 2, and 3), Feedback (FB1, FB2, FB3, LDO_FB), VDDI

-

-0.3 to 3

V

All Other Pins (EN1, 2, 3, EN_LDO, PGOOD, VGREG, LDO, VOUT1)

ESD Voltage (1)

Human Body Model (HBM) All Pins

-

-0.3 to 7

V

VESD

V

+ 2000

THERMAL RATINGS

Operating Temperature

Ambient

Junction

Peak Package Temperature During Reflow (2), (3)

Storage Temperature

THERMAL RESISTANCE

Thermal Resistance (2)

Junction-to-Case

Junction-to-Ambient

Power Dissipation

TA = 25°C

TA = 70°C

TA = 85°C

TA

TJ

TPPRT

TSTRG

TΘJC

TΘJA

PD

-40 to +85

-40 to +125

300

-40 to +150

6.7

37

2.5

1.3

1.0

°C

°C

°C

°C/W

W

Notes

1. ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 Ω).

2. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

3. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes

and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.

Analog Integrated Circuit Device Data

Freescale Semiconductor

34700

3

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