ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 4. DYNAMIC ELECTRICAL CHARACTERISTICS
Characteristics noted under conditions -40°C ≤ TA ≤ 85°C unless otherwise noted. Input voltages VIN1 = VIN2 = 3.3V using
the typical application circuit (see Figures 33), unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
BUCK CONVERTER
Duty Cycle Range (Normal Operation)(18)
Switching Node SW Rise Time(18)
VIN = 5.0V, ILOAD = 1.0A
tD
tRISE
0.0
–
95
%
ns
–
7.0
–
Switching Node SW Fall Time(18)
VIN = 5.0V, ILOAD = 1.0A
tFALL
ns
–
17
–
Maximum Deadtime(18)
tD
Buck Control Loop Propagation Delay(18)
tPD
VINV < 0.8V to VSW > 90% of High Level or VINV > 0.8V to VSW < 10%
of Low Level
–
35
–
ns
ns
–
50
–
Soft Start Duration (Power Sequencing Disabled, EN1 = 1, EN2 = 1)(18)
tSS
200
350
800
µs
Fault Condition Timeout(18)
tFAULT
7.0
10
15
ms
Retry Timer Cycle(18)
tRET
70
100
150
ms
OSCILLATOR
Oscillator Center Frequency(20)
RF = 11.3kΩ
fOSC
270
300
330
kHz
Oscillator Frequency Range
Oscillator Frequency Adjusting Resistor Range
Oscillator Frequency Adjustment(19), (20)
RF = 7.0kΩ
Oscillator Frequency Adjustment(19), (20)
RF = 22kΩ
fOSC
200
–
400
kHz
RFREQ
7.0
–
22
kΩ
fOSC
400
–
kHz
–
fOSC
kHz
–
–
200
Oscillator Default Frequency (Switching Frequency), FREQ Pin Open
Oscillator Output Signal Duty Cycle (Square Wave, 180° Out-of-Phase with
the Internal Suitable Oscillator)
Synchronization Pulse Minimum Duration(18)
Notes
18. Design information only. This parameter is not production tested.
19. see Figure 4 for more details
20. RF is RFREQ
fOSC
DOSC
tSYNC
–
300
40
50
1.0
–
–
kHz
%
60
–
µs
34701
12
Analog Integrated Circuit Device Data
Freescale Semiconductor