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MC74LCX16374(2012) 查看數據表(PDF) - ON Semiconductor

零件编号
产品描述 (功能)
生产厂家
MC74LCX16374
(Rev.:2012)
ON-Semiconductor
ON Semiconductor ON-Semiconductor
MC74LCX16374 Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
1
SCALE 1:1
TSSOP48
CASE 120101
ISSUE B
DATE 06 JUL 2010
L
PIN 1
IDENT.
D
0.076 (0.003)
TSEATING
PLANE
48X K REF
0.12 (0.005) M T U S V S
48
25
1
24
A
V
C
G
RECOMMENDED
SOLDERING FOOTPRINT
48X
0.32
J ÇÇÇJ1 ÇÇÇÉÉÉKKÇÇÇÉÉÉ1 ÇÇÇ
SECTION NN
B
UN
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSIONS A AND B ARE TO BE
DETERMINED AT DATUM PLANE W.
N
F
M
DETAIL E 0.25 (0.010)
DETAIL E
H
W
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 12.40 12.60 0.488 0.496
B 6.00 6.20 0.236 0.244
C
−−− 1.10
−−− 0.043
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G
0.50 BSC
0.0197 BSC
H 0.37 −−− 0.015 −−−
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.17 0.27 0.007 0.011
K1 0.17 0.23 0.007 0.009
L 7.95 8.25 0.313 0.325
M
0_ 8_ 0_ 8_
GENERIC
MARKING DIAGRAM*
48X
1.00
XXXXXXXXXXXG
AWLYYWW
1
XXXXX = Specific Device Code
A
= Assembly Location
WL = Wafer Lot
8.45
YY
= Year
WW = Work Week
G
= PbFree Package
*This information is generic. Please refer
to device data sheet for actual part
marking.
1
0.50
PITCH
DIMENSIONS: MILLIMETERS
DOCUMENT NUMBER: 98ASH70297A
DESCRIPTION: TSSOP48
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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