MC74LVX139D 查看數據表（PDF） - ON Semiconductor

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MC74LVX139D

Dual 2-to-4 Decoder/Demultiplexer

ON Semiconductor 

MC74LVX139

K

t TOP

COVER

TAPE

B1

K0

SEE

NOTE 7.

FOR MACHINE REFERENCE

ONLY

INCLUDING DRAFT AND RADII

CONCENTRIC AROUND B0

10 PITCHES

CUMULATIVE

TOLERANCE ON

TAPE

P0

±0.2 mm

D

P2

(±0.008”)

E

A0 SEE NOTE 7.

+ B0

+

+

FW

P

EMBOSSMENT

USER DIRECTION OF FEED

CENTER

LINES

OF CAVITY

D1

FOR COMPONENTS

2.0 mm × 1.2 mm

AND LARGER

R MIN.

BENDING RADIUS

TAPE AND COMPONENTS

SHALL PASS AROUND RADIUS “R”

WITHOUT DAMAGE

EMBOSSED

CARRIER

*TOP COVER

TAPE THICKNESS (t1)

0.10 mm

(0.004”) MAX.

EMBOSSMENT

MAXIMUM COMPONENT ROTATION

10°

TYPICAL

COMPONENT CAVITY

CENTER LINE

100 mm

(3.937”)

1 mm MAX

TAPE

TYPICAL

COMPONENT

CENTER LINE

1 mm

(0.039”) MAX

250 mm

(9.843”)

CAMBER (TOP VIEW)

ALLOWABLE CAMBER TO BE 1 mm/100 mm NONACCUMULATIVE OVER 250 mm

7. A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min to

0.50 mm max. The component cannot rotate more than 10° within the determined cavity

Figure 9. Carrier Tape Specifications

http://onsemi.com

6

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