MC78LC33NTR 查看數據表（PDF） - ON Semiconductor
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MC78LC33NTR Datasheet PDF : 12 Pages
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MC78LC00 Series
PACKAGE DIMENSIONS
TSOP−5 (SOT23−5)
NTR SUFFIX
CASE 483−02
ISSUE H
NOTE 5
2X 0.10 T
D 5X
0.20 C A B
2X
0.20 T
5
4 BS
1 23
L
G
A
M
K
DETAIL Z
J
C
0.05
H
SEATING
PLANE
T
DETAIL Z
SOLDERING FOOTPRINT*
0.95
0.037
1.9
0.074
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5. OPTIONAL CONSTRUCTION: AN
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
MILLIMETERS
DIM MIN MAX
A
3.00 BSC
B
1.50 BSC
C 0.90 1.10
D 0.25 0.50
G
0.95 BSC
H 0.01 0.10
J 0.10 0.26
K 0.20 0.60
L 1.25 1.55
M
0 _ 10 _
S 2.50 3.00
2.4
0.094
1.0
0.039
0.7
0.028
ǒ Ǔ SCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
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