MCIMX255AJM4A(2010) 查看數據表（PDF） - Freescale Semiconductor

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MCIMX255AJM4A
(Rev.:2010)

i.MX25 Applications Processor for Automotive Products

Freescale Semiconductor 

Freescale Semiconductor

Data Sheet: Technical Data

Document Number: IMX25AEC

Rev. 5, 09/2010

MCIMX25

i.MX25 Applications

Processor for Automotive

Products

Silicon Version 1.2

Package Information

Plastic package

Case 5284 17 x 17 mm, 0.8 mm Pitch

Ordering Information

See Table 1 on page 3 for ordering information.

1 Introduction

The i.MX25 family of processors offers integration

that tailors itself to the connectivity requirements of

today's automobile infotainment systems. These

processors have been architected to meet auto

infotainment requirements like CAN, USB

connectivity, and audio connectivity, without many

of the extra features only needed for high-end

applications. As a result, the i.MX25 enables many

of the features only available in high-end systems,

but at a price point suitable for all vehicles.

At the core of the i.MX25 is Freescale's fast,

proven, power-efficient implementation of the

ARM926EJ-S core, with speeds of up to 400 MHz.

The i.MX25 includes support for up to 133-MHz

DDR2 memory, integrated 10/100 Ethernet MAC,

and two on-chip USB PHYs. The automotive

versions of the i.MX25 offer AEC-Q100 grade 3

1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3

1.2. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.1. Special Signal Considerations . . . . . . . . . . . . . . . . 9

3. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 11

3.1. i.MX25 Chip-Level Conditions . . . . . . . . . . . . . . . . 11

3.2. Supply Power-Up/Power-Down Requirements and

Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

3.3. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . 18

3.4. Thermal Characteristics . . . . . . . . . . . . . . . . . . . . 19

3.5. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 20

3.6. AC Electrical Characteristics . . . . . . . . . . . . . . . . 25

3.7. Module Timing and Electrical Parameters . . . . . . 42

4. Package Information and Contact Assignment . . . . . . 124

4.1. 400 MAPBGA—Case 17x17 mm, 0.8 mm Pitch . 124

4.2. Ground, Power, Sense, and Reference Contact

Assignments Case 17x17 mm, 0.8 mm Pitch . . . 125

4.3. Signal Contact Assignments—17 x 17 mm, 0.8 mm

Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127

4.4. i.MX25 17x17 Package Ball Map . . . . . . . . . . . . 130

5. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133

© Freescale Semiconductor, Inc., 2010. All rights reserved.

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