MCP1603 查看數據表（PDF） - Microchip Technology

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MCP1603

2.0 MHz, 500 mA Synchronous Buck Regulator

Microchip Technology 

MCP1603/B/L

DC CHARACTERISTICS (CONTINUED)

Electrical Characteristics: Unless otherwise indicated, MCP1603/L, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF,

L = 4.7 µH, VOUT(ADJ) = 1.8V, IOUT = 100 mA, TA = +25°C. Boldface specifications apply over the TA range of -40°C

to +85°C.

Parameters

Sym

Min Typ Max Units

Conditions

Output Characteristics

Adjustable Output Voltage Range VOUT

0.8

—

4.5

V Note 2

Reference Feedback Voltage

VFB

—

0.8

—

V

Reference Feedback Voltage

-3.0

—

+3.0

% TA = -40°C to +25°C

Tolerance

-2.5

—

+2.5

% TA = +25°C to +85°C

Feedback Input Bias Current

IVFB

—

0.1

—

nA

Output Voltage Tolerance Fixed

VOUT

-3.0% VR +3.0% % TA = -40°C to +25°C, Note 3

VOUT

-2.5

VR

+2.5

% TA = +25°C to +85°C, Note 3

Line Regulation

VLINE-REG

—

0.3

—

%/V VIN = VR + 1V to 5.5V,

IOUT = 100 mA

Load Regulation

VLOAD-REG

—

0.35

—

% VIN = VR +1.5V,

ILOAD = 100 mA to 500 mA

Internal Oscillator Frequency

FOSC

1.5

2.0

2.8 MHz

Start Up Time

TSS

—

0.6

—

ms TR = 10% to 90%

RDSon P-Channel

RDSon-P

—

500

—

m IP = 100 mA

RDSon N-Channel

RDSon-N

—

500

—

m IN = 100 mA

LX Pin Leakage Current

ILX

-1.0 ±0.1 1.0

µA SHDN = 0V, VIN = 5.5V,

LX = 0V, LX = 5.5V

Positive Current Limit Threshold +ILX(MAX)

—

860

—

mA Note 6

Note 1: The input voltage should be greater then the output voltage plus headroom voltage; higher load currents

increase the input voltage required for regulation. MCP1603B device requires a minimum load for

regulation. See Section 2.0, Typical Performance Curves for typical operating voltage ranges.

2: Reference Feedback Voltage Tolerance applies to adjustable output voltage setting.

3: VR is the output voltage setting.

4: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

temperature and the thermal resistance from junction to air (i.e. TA, TJ, JA). Exceeding the maximum

allowable power dissipation causes the device to initiate thermal shutdown.

5: The internal MOSFET switches have an integral diode from the LX pin to the VIN pin, and from the LX pin

to the GND pin. In cases where these diodes are forward-biased, the package power dissipation limits

must be adhered to. Thermal protection is not able to limit the junction temperature for these cases.

6: The current limit threshold is a cycle-by-cycle peak current limit.

TEMPERATURE SPECIFICATIONS

Electrical Specifications: Unless otherwise indicated, all limits are specified for: VIN + 2.7V to 5.5V

Parameters

Sym Min Typ Max Units

Conditions

Temperature Ranges

Operating Junction Temperature Range TJ -40 —

Storage Temperature Range

TA -65 —

Maximum Junction Temperature

TJ

—

—

Package Thermal Resistances

+125

+150

+150

°C Steady State

°C

°C Transient

Thermal Resistance, 5L-TSOT

JA

— 207.4

—

°C/W Typical 4-layer Board with

Internal Ground Plane

Thermal Resistance, 8L-2x3 DFN

JA

—

68

— °C/W Typical 4-layer Board with

Internal Ground Plane and

2-Vias in Thermal Pad

DS22042B-page 6

 2007-2012 Microchip Technology Inc.

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