MCP1624(2010) 查看數據表（PDF） - Microchip Technology
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MCP1624 Datasheet PDF : 26 Pages
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MCP1623/24
DC CHARACTERISTICS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, VIN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V,
IOUT = 15 mA, TA = +25°C.
Boldface specifications apply over the TA range of -40oC to +85oC.
Parameters
Sym. Min.
Typ.
Max. Units
Conditions
NMOS Peak Switch Current
IN(MAX)
300
425
Limit
—
mA Note 5
VOUT Accuracy
Line Regulation
Load Regulation
Maximum Duty Cycle
Switching Frequency
EN Input Logic High
EN Input Logic Low
EN Input Leakage Current
Soft-start Time
Thermal Shutdown Die
Temperature
VOUT% -7.4
—
VOUT/V —
OUT) /
VIN|
VOUT /
—
VOUT|
DCMAX
—
fSW
370
VIH
90
VIL
—
IENLK
—
tSS
—
TSD
—
0.01
0.01
90
500
—
—
0.005
750
150
+7.4
—
—
—
630
—
20
—
—
—
% Includes Line and Load
Regulation; VIN = 1.5V
IOUT = 50 mA
%/V VIN = 1.5V to 3V
IOUT = 25 mA
% IOUT = 25 mA to 50 mA;
VIN = 1.5V
%
kHz
%of VIN IOUT = 1 mA
%of VIN IOUT = 1 mA
µA VEN = 5V
µS EN Low-to-High, 90% of
VOUT; Note 4
C
Die Temperature Hysteresis
TSDHYS
—
10
—
C
Note 1: 3.3 K resistive load, 3.3VOUT (1 mA).
2: For VIN > VOUT, VOUT will not remain in regulation.
3: IQ is measured from VOUT; VIN quiescent current will vary with boost ratio. VIN quiescent current can be
estimated by: (IQPFM * (VOUT/VIN)), (IQPWM * (VOUT/VIN)).
4: 220 resistive load, 3.3VOUT (15 mA).
5: Peak current limit determined by characterization, not production tested.
TEMPERATURE SPECIFICATIONS
Electrical Specifications:
Parameters
Sym. Min. Typ.
Temperature Ranges
Operating Junction Temperature
TJ
-40
—
Range
Storage Temperature Range
TA
-65
—
Maximum Junction Temperature
TJ
—
—
Package Thermal Resistance
Thermal Resistance, 5L-TSOT23
JA
—
192
Max. Units
Conditions
+125
+150
+150
°C Steady State
°C
°C Transient
—
°C/W EIA/JESD51-3 Standard
DS41420B-page 4
2010 Microchip Technology Inc.
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