MCP1700T-3302E 查看數據表（PDF） - Microchip Technology

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MCP1700T-3302E

Low Quiescent Current LDO

Microchip Technology 

MCP1700

3-Lead Plastic Small Outline Transistor (TT or NB) [SOT-23]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

b

N

E

E1

1

2

e

e1

D

c

A

A2

φ

A1

L

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Pins

N

3

Lead Pitch

e

0.95 BSC

Outside Lead Pitch

e1

1.90 BSC

Overall Height

A

0.89

–

1.12

Molded Package Thickness

A2

0.79

0.95

1.02

Standoff

A1

0.01

–

0.10

Overall Width

E

2.10

–

2.64

Molded Package Width

E1

1.16

1.30

1.40

Overall Length

D

2.67

2.90

3.05

Foot Length

L

0.13

0.50

0.60

Foot Angle

φ

0°

–

10°

Lead Thickness

c

0.08

–

0.20

Notes:

Lead Width

b

0.30

–

0.54

1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.

2. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing C04-104B

DS21826B-page 16

© 2007 Microchip Technology Inc.

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