MCP1700T-3302E 查看數據表（PDF） - Microchip Technology

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MCP1700T-3302E

Low Quiescent Current LDO

Microchip Technology 

MCP1700

3-Lead Plastic Transistor Outline (TO or ZB) [TO-92]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

E

A

1

N

L

12 3

b

e

c

D

R

Units

INCHES

Dimension Limits

MIN

MAX

Number of Pins

N

3

Pitch

e

.050 BSC

Bottom to Package Flat

D

.125

.165

Overall Width

E

.175

.205

Overall Length

A

.170

.210

Molded Package Radius

R

.080

.105

Tip to Seating Plane

L

.500

–

Lead Thickness

c

.014

.021

Notes:

Lead Width

b

.014

.022

1. Dimensions A and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" per side.

2. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing C04-101B

DS21826B-page 18

© 2007 Microchip Technology Inc.

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