MF-USMD005 查看數據表（PDF） - Bourns, Inc
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MF-USMD005 Datasheet PDF : 4 Pages
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Additional Features
■ Patents pending
MF-USMD Series - PTC Resettable Fuses
Product Dimensions
Model
MF-USMD005
MF-USMD010
MF-USMD020
MF-USMD035
MF-USMD050
MF-USMD075
MF-USMD110
A
Min.
3.00
(0.118)
3.00
(0.118)
3.00
(0.118)
3.00
(0.118)
3.00
(0.118)
3.00
(0.118)
3.00
(0.118)
Max.
3.43
(0.135)
3.43
(0.135)
3.43
(0.135)
3.43
(0.135)
3.43
(0.135)
3.43
(0.135)
3.43
(0.135)
Packaging: 3000 pcs. per reel.
Min.
2.35
(0.093)
2.35
(0.093)
2.35
(0.093)
2.35
(0.093)
2.35
(0.093)
2.35
(0.093)
2.35
(0.093)
B
Max.
2.80
(0.110)
2.80
(0.110)
2.80
(0.110)
2.80
(0.110)
2.80
(0.110)
2.80
(0.110)
2.80
(0.110)
Top and Bottom View
A
Side View
C
Recommended Pad Layout
1.1 ± 0.1
(.043 ± .004)
1.1 ± 0.1
(.043 ± .004)
B
2.6 ± 0.1
(.102 ± .004)
1.70 ± 0.1
D
(.067 ± .004)
Terminal material: solder-plated copper
Termination pad solderability: Meets EIA Specification RS-186-9E, ANSI/J-STD-002 Category 3.
C
Min.
0.50
(0.020)
0.50
(0.020)
0.50
(0.020)
0.38
(0.015)
0.38
(0.015)
0.38
(0.015)
0.30
(0.012)
Max.
0.85
(0.033)
0.85
(0.033)
0.85
(0.033)
0.62
(0.025)
0.62
(0.024)
0.62
(0.025)
0.48
(0.019)
Typical Part Marking
D
Min.
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
UNIT = MM
(INCHES)
Represents total content. Layout may vary.
PART IDENTIFICATION
MANUFACTURER'S
TRADEMARK
051
Z
YEAR CODE -
2001 = 1
BIWEEKLY DATE CODE -
WEEK 51 & 52 = Z
Solder Reflow Recommendations
300
Preheating
Soldering
Cooling
250
200
150
100
50
0
160–220
10–20
120
Note:
Time (seconds)
• MF-USMD models can be wave soldered and reworked.
• If reflow temperatures exceed the recommended profile, devices may not meet the performance
requirements.
Specifications are subject to change without notice.
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