FS0401M 查看數據表（PDF） - Formosa Technology
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FS0401M Datasheet PDF : 5 Pages
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FS04...D
SURFACE MOUNT SCR
Fig. 1: Maximum average power dissipation
versus average on-state current
P (W)
4.0
360 º
3.5
α
3.0
2.5
2.0
α = 80 º
1.5
1.0
0.5
0
IT(AV)(A)
0 0.5 1 1.5 2 2.5 3 3.5
Fig. 3: Average and DC on-state current versus
ambient temperature (device mounted on FR4
with recommended pad layout)
I T(AV) (A)
2.0
1.8
DC
1.6
1.4
1.2
1.0
0.8
α = 180 º
0.6
0.4
0.2
0
Tamb (ºC)
0 25 50 75 100 125
Fig. 4-2: Relative variation of thermal
impedance junction to ambient versus pulse
duration. (recommended pad layout)
K=[Zth(j-a) / Rth(j-a)]
1.00
0.10
0.01
tp (s)
1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
Fig. 2: Correlation between maximum average power dissipation and
maximum allowable temperatures (Tamb and T case) for different
thermal resistances heatsink+contact.
P (W)
4.0
Rth= 10C/W
T case (ºC)
Rth= 0C/W
3.5
3.0
Rth= 15C/W
Rth= 37C/W
Rth= 5C/W
115
2.5
2.0
120
1.5
1.0
α=180º
0.5
0
125 Tamb (ºC)
0 25 50 75 100 125
Fig. 4-1: Relative variation of thermal
impedance junction to case versus pulse
duration.
K=[Zth(j-c) / Rth(j-c)]
1.0
0.5
0.2
0.1
tp (s)
1E-3
1E-2
1E-1
1E+0
Fig. 5: Relative variation of gate trigger current
and holding current versus junction temperature.
Igt (Tj)
Igt (Tj = 25 ºC)
2.0
Ih (Tj)
Ih (Tj = 25 ºC)
1.8
1.6
1.4
1.2
1.0
Igt
0.8
0.6
0.4 Ih
0.2
0
Tj (ºC)
-40 -20 0 20 40 60 80 100 120 140
Jun- 02
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