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MP03HBN190 查看數據表(PDF) - Dynex Semiconductor

零件编号
产品描述 (功能)
生产厂家
MP03HBN190
Dynex
Dynex Semiconductor Dynex
MP03HBN190 Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
MP03 XXX 190 Series
GATE TRIGGER CHARACTERISTICS AND RATINGS
Symbol
VGT
IGT
V
GD
VRGM
IFGM
P
GM
PG(AV)
Parameter
Gate trigger voltage
Gate trigger current
Gate non-trigger voltage
Peak reverse gate voltage
Peak forward gate current
Peak gate power
Mean gate power
Conditions
VDRM = 6V, Tcase = 25oC, RL = 6
V = 6V,
DRM
T
case
=
25oC,
R
L
=
6
V = V , T = 125˚C
D
DRM j
Anode positive with respect to cathode
Typ. Max. Units
- 3.0 V
- 200 mA
- 0.20 V
- 5.0 V
-
4
A
-
16 W
-
3
W
ORDERING INSTRUCTIONS
Part number is made up of as follows:
Examples:
MP03 HBT 190 - 12
MP
03
HBT
190
12
= Pressure contact module
= Outline type
= Circuit configuration code (see "circuit options" - front page)
= Nominal average current rating at Tcase = 75oC
= VRRM/100
MP03 HBP190 - 08
MP03 HBN190 - 12
MP03 HBT190 - 10
Note: Diode ratings and characteristics are comparable with SCR in types HBP or HBN.
Types HBP or HBN can also be supplied with diode polarity reversed, to special order.
MOUNTING RECOMMENDATIONS
Adequate heatsinking is required to maintain the base temperature
at 75oC if full rated current is to be achieved. Power dissipation
may be calculated by use of V and r information in accordance
T(TO)
T
with standard formulae. We can provide assistance with
calculations or choice of heatsink if required.
The heatsink surface must be smooth and flat; a surface finish of
N6 (32µin) and a flatness within 0.05mm (0.002") are
recommended.
Immediately prior to mounting, the heatsink surface should be
lightly scrubbed with fine emery, Scotch Brite or a mild chemical
etchant and then cleaned with a solvent to remove oxide build up
and foreign material. Care should be taken to ensure no foreign
particles remain.
An even coating of thermal compound (eg. Unial) should be
applied to both the heatsink and module mounting surfaces. This
should ideally be 0.05mm (0.002") per surface to ensure optimum
thermal performance.
After application of thermal compound, place the module squarely
over the mounting holes, (or 'T' slots) in the heatsink. Using a
torque wrench, slowly tighten the recommended fixing bolts at
each end, rotating each in turn no more than 1/4 of a revolution at
a time. Continue until the required torque of 5Nm (44lb.ins) is
reached at both ends.
It is not acceptable to fully tighten one fixing bolt before starting to
tighten the others. Such action may DAMAGE the module.
3/10

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