MP3H6115A6T1 查看數據表（PDF） - Freescale Semiconductor
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MP3H6115A6T1 Datasheet PDF : 13 Pages
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Pressure
On-chip Temperature Compensation and Calibration
Figure 2 illustrates the absolute sensing chip in the basic
Super Small Outline chip carrier (Case 1317).
Figure 3 shows a typical application circuit (output source
current operation).
Figure 4 shows the sensor output signal relative to
pressure input. Typical minimum and maximum output
curves are shown for operation over 0 to 85°C temperature
range. The output will saturate outside of the rated pressure
range.
A fluorosilicone gel isolates the die surface and wire bonds
from the environment, while allowing the pressure signal to
be transmitted to the silicon diaphragm. The MP3H6115A
series pressure sensor operating characteristics, internal
reliability and qualification tests are based on use of dry air as
the pressure media. Media other than dry air may have
adverse effects on sensor performance and long-term
reliability. Contact the factory for information regarding media
compatibility in your application.
Fluoro Silicone
Gel Die Coat
Wire Bond
Lead frame
Die
P1
Stainless Steel
Cap
Thermoplastic
Case
MP3H6115A
4
Absolute Element
Die Bond
Sealed Vacuum Reference
Figure 2. Cross Sectional Diagram SSOP (not to scale)
+3 V
100 nF
VS Pin 2
MP3H6115A
VOUT Pin 4
GND Pin 3
47 pF
to ADC
51 K
GND
Figure 3. Typical Application Circuit
(Output Source Current Operation)
3.0
2.75 Transfer Function:
Max
2.5 VOUT = VS x (.009xP–.095) ± Error
2.25
VS = 3.0 VDC
Temp = 0 to 85°C
2.0
1.75
Typ
1.5
1.25
1.0
0.75
0.5
Min
0.25
0
Pressure (Reference to Sealed Vacuum) in kPa
Figure 4. Output versus Absolute Pressure
Sensors
Freescale Semiconductor, Inc.
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