MPC7457(2004) 查看數據表（PDF） - Freescale Semiconductor

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MPC7457
(Rev.:2004)

RISC Microprocessor Hardware Specifications

Freescale Semiconductor 

Electrical and Thermal Characteristics

Table 5 provides the package thermal characteristics for the MPC7457.

Table 5. Package Thermal Characteristics 1

Characteristic

Value

Symbol

Unit Notes

MPC7447 MPC7457

Junction-to-ambient thermal resistance, natural convection

RθJA

22

Junction-to-ambient thermal resistance, natural convection,

RθJMA

14

four-layer (2s2p) board

20

°C/W

2, 3

14

°C/W

2, 4

Junction-to-ambient thermal resistance, 200 ft/min airflow,

RθJMA

16

single-layer (1s) board

15

°C/W

2, 4

Junction-to-ambient thermal resistance, 200 ft/min airflow,

RθJMA

11

four-layer (2s2p) board

11

°C/W

2, 4

Junction-to-board thermal resistance

Junction-to-case thermal resistance

Coefficient of thermal expansion

RθJB

RθJC

6

<0.1

6.8

6

°C/W

5

<0.1

°C/W

6

6.8

ppm/°C

Notes:

1. Refer to Section 9.8, “Thermal Management Information,” for more details about thermal management.

2. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal

resistance.

3. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.

4. Per JEDEC JESD51-6 with the board horizontal.

5. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured

on the top surface of the board near the package.

6. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method

1012.1) with the calculated case temperature. The actual value of RθJC for the part is less than 0.1°C/W.

Table 6 provides the DC electrical characteristics for the MPC7457.

Table 6. DC Electrical Specifications

At recommended operating conditions. See Table 4.

Nominal

Characteristic

Bus Symbol

Min

Max

Voltage 1

Input high voltage

1.5

(all inputs including SYSCLK)

1.8

2.5

Input low voltage

1.5

(all inputs including SYSCLK)

1.8

2.5

Input leakage current, Vin = GVDD/OVDD

—

High-impedance (off-state) leakage

—

current, Vin = GVDD/OVDD

VIH

GVDD × 0.65

GVDD + 0.3

OVDD/GVDD × 0.65 OVDD/GVDD + 0.3

1.7

OVDD/GVDD + 0.3

VIL

–0.3

GVDD × 0.35

–0.3

OVDD/GVDD × 0.35

–0.3

0.7

Iin

—

30

ITSI

—

30

Unit

V

V

V

V

V

V

µA

µA

Notes

2

2, 6

2, 3

2, 3, 4

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 5

Freescale Semiconductor

13

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