MPX4250D 查看數據表（PDF） - Motorola => Freescale
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MPX4250D
Motorola => Freescale
MPX4250D Datasheet PDF : 8 Pages
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FLUORO SILICONE
DIE COAT
STAINLESS STEEL
DIE
METAL COVER
WIRFELREBAAOMDNEÉÉÉÉD ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉP1ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
RTV DIE
BOND
P2
EPOXY CASE
Figure 2. Cross–Sectional Diagram
(Not to Scale)
MPX4250D
OUPUT
(PIN 1)
50 pF
MPX4250D SERIES
A/D
51 k
µ PROCESSOR
Figure 3. Typical Decoupling Filter for Sensor to
Microprocessor Interface
Figure 2 illustrates the Differential/Gauge Pressure Sens-
ing Chip in the basic chip carrier (Case 867). A fluorosilicone
gel isolates the die surface and wire bonds from the environ-
ment, while allowing the pressure signal to be transmitted to
the sensor diaphragm.
The MPX4250D series pressure sensor operating charac-
teristics, and internal reliability and qualification tests are
based on use of dry air as the pressure media. Media, other
than dry air, may have adverse effects on sensor performance
and long–term reliability. Contact the factory for information
regarding media compatibility in your application.
Figure 3 shows a typical decoupling circuit for interfacing
the integrated sensor to the A/D input of a microprocessor.
Proper decoupling of the power supply is recommended.
Figure 4 shows the sensor output signal relative to pres-
sure input. Typical, minimum, and maximum output curves
are shown for operation over a temperature range of 0° to
85°C using the decoupling circuit below. (The output will sat-
urate outside of the specified pressure range.)
5.0
MAX
4.5 TRANSFER FUNCTION:
4.0 Vout = VS* (0.00369*P + 0.04) ± Error
VS = 5.1 Vdc
3.5 TEMP = 0 to 85°C
TYP
3.0
2.5
2.0
1.5
MIN
1.0
0.5
0
PRESSURE in kPa
Figure 4. Output versus Differential Pressure
Motorola Sensor Device Data
3
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