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128M16 查看數據表(PDF) - Micron Technology

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128M16
Micron
Micron Technology Micron
128M16 Datasheet PDF : 211 Pages
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2Gb: x4, x8, x16 DDR3 SDRAM
Features
Input Clock Frequency Change ...................................................................................................................... 124
Write Leveling ............................................................................................................................................... 126
Write Leveling Procedure ........................................................................................................................... 128
Write Leveling Mode Exit Procedure ........................................................................................................... 130
Initialization ................................................................................................................................................. 131
Mode Registers .............................................................................................................................................. 133
Mode Register 0 (MR0) ................................................................................................................................... 134
Burst Length ............................................................................................................................................. 134
Burst Type ................................................................................................................................................. 135
DLL RESET ................................................................................................................................................ 136
Write Recovery .......................................................................................................................................... 136
Precharge Power-Down (Precharge PD) ...................................................................................................... 137
CAS Latency (CL) ....................................................................................................................................... 137
Mode Register 1 (MR1) ................................................................................................................................... 138
DLL ENABLE/DISABLE .............................................................................................................................. 138
Output Drive Strength ............................................................................................................................... 139
OUTPUT ENABLE/DISABLE ...................................................................................................................... 139
TDQS ENABLE .......................................................................................................................................... 139
On-Die Termination (ODT) ........................................................................................................................ 140
WRITE LEVELING ..................................................................................................................................... 140
Posted CAS Additive Latency (AL) ............................................................................................................... 140
Mode Register 2 (MR2) ................................................................................................................................... 142
CAS WRITE Latency (CWL) ........................................................................................................................ 142
AUTO SELF REFRESH (ASR) ....................................................................................................................... 143
SELF REFRESH TEMPERATURE (SRT) ........................................................................................................ 143
SRT versus ASR .......................................................................................................................................... 144
Dynamic On-Die Termination (ODT) ......................................................................................................... 144
Mode Register 3 (MR3) ................................................................................................................................... 145
MULTIPURPOSE REGISTER (MPR) ............................................................................................................ 145
MPR Functional Description ...................................................................................................................... 146
MPR Address Definitions and Bursting Order .............................................................................................. 147
MPR Read Predefined Pattern .................................................................................................................... 152
MODE REGISTER SET (MRS) Command ........................................................................................................ 152
ZQ CALIBRATION Operation ......................................................................................................................... 153
ACTIVATE Operation ..................................................................................................................................... 154
READ Operation ............................................................................................................................................ 156
WRITE Operation .......................................................................................................................................... 167
DQ Input Timing ....................................................................................................................................... 175
PRECHARGE Operation ................................................................................................................................. 177
SELF REFRESH Operation .............................................................................................................................. 177
Extended Temperature Usage ........................................................................................................................ 179
Power-Down Mode ........................................................................................................................................ 180
RESET Operation ........................................................................................................................................... 188
On-Die Termination (ODT) ............................................................................................................................ 190
Functional Representation of ODT ............................................................................................................. 190
Nominal ODT ............................................................................................................................................ 190
Dynamic ODT ............................................................................................................................................... 192
Dynamic ODT Special Use Case ................................................................................................................. 192
Functional Description .............................................................................................................................. 192
Synchronous ODT Mode ................................................................................................................................ 198
ODT Latency and Posted ODT .................................................................................................................... 198
Timing Parameters .................................................................................................................................... 198
PDF: 09005aef826aaadc
2Gb_DDR3_SDRAM.pdf - Rev. Q 04/13 EN
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
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