MCM69T618 查看數據表（PDF） - Motorola => Freescale
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MCM69T618 Datasheet PDF : 10 Pages
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TRUTH TABLE (See Notes 1 through 4)
Next Cycle
SE
SW
DE
MG
G
Match
DQ
Read
0
1
X
X
0
—
Data Out
Write
0
0
0
X
1
—
Data In
Compare
0
1
0
0
1
Data Out
Data In
Fill Write
0
0
1
X
1
—
High–Z
Deselected (Match Out)
1
X
X
0
X
Data High
High–Z
Deselected
1
X
X
1
X
High–Z
High–Z
NOTES:
1. X = Don’t Care. 1 = logic high. 0 = logic low.
2. SE low is defined as SE1 = 0 and SE0 = 1. SE high is defined as SE1 = 1 or SE0 = 0.
3. G and MG are asynchronous signals and are not sampled by the clock K. G drives the bus immediately (tGLQX) when G goes low.
4. On write cycles that follow read cycles, G must be negated prior to the start of the write cycle to ensure proper write data setup times. G must
also remain negated at the completion of the write cycle to ensure proper write data hold times.
ABSOLUTE MAXIMUM RATINGS (See Note)
Rating
Symbol
Value
Unit
Power Supply Voltage
VCC
– 0.5 to + 4.6
V
Voltage Relative to VSS for Any
Pin Except VCC
Vin, Vout
VCC + 0.5
V
Output Current (per I/O)
Iout
± 20
mA
Package Power Dissipation
PD
1.6
W
Temperature Under Bias
Tbias
– 10 to + 85
°C
Storage Temperature
Tstg
– 55 to + 125
°C
NOTE: Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are
exceeded. Functional operation should be restricted to RECOMMENDED OPER-
ATING CONDITIONS. Exposure to higher than recommended voltages for
extended periods of time could affect device reliability.
This device contains circuitry to protect the
inputs against damage due to high static volt-
ages or electric fields; however, it is advised
that normal precautions be taken to avoid
application of any voltage higher than maxi-
mum rated voltages to this high–impedance
circuit.
PACKAGE THERMAL CHARACTERISTICS (See Note 1)
Rating
Symbol
Max
Unit Notes
Junction to Ambient (@ 200 lfm)
Single–Layer Board
Four–Layer Board
RθJA
40
°C/W
2
25
Junction to Board (Bottom)
RθJB
17
°C/W
3
Junction to Case (Top)
RθJC
9
°C/W
4
NOTES:
1. Junction temperature is a function of on–chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, board population, and board thermal resistance.
2. Per SEMI G38–87.
3. Indicates the average thermal resistance between the die and the printed circuit board.
4. Indicates the average thermal resistance between the die and the case top surface via the cold plate method (MIL SPEC–883 Method 1012.1).
MOTOROLA FAST SRAM
MCM69T618
5
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