MTP10N40E
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain–to–Source Breakdown Voltage
(VGS = 0, ID = 0.25 mA)
Zero Gate Voltage Drain Current
(VDS = 400 V, VGS = 0)
(VDS = 320 V, VGS = 0, TJ = 125°C)
Gate–Body Leakage Current — Forward (VGSF = 20 Vdc, VDS = 0)
Gate–Body Leakage Current — Reverse (VGSR = 20 Vdc, VDS = 0)
ON CHARACTERISTICS*
Gate Threshold Voltage
(VDS = VGS, ID = 0.25 mAdc)
(TJ = 125°C)
Static Drain–to–Source On–Resistance (VGS = 10 Vdc, ID = 5.0 A)
Drain–to–Source On–Voltage (VGS = 10 Vdc)
(ID = 5.0 A)
(ID = 2.5 A, TJ = 100°C)
Forward Transconductance (VDS = 15 Vdc, ID = 5.0 A)
DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance
Transfer Capacitance
(VDS = 25 V, VGS = 0,
f = 1.0 MHz)
SWITCHING CHARACTERISTICS*
Turn–On Delay Time
Rise Time
Turn–Off Delay Time
Fall Time
(VDD = 200 V, ID ≈ 10 A,
RL = 20 Ω, RG = 9.1 Ω,
VGS(on) = 10 V)
Total Gate Charge
Gate–Source Charge
Gate–Drain Charge
(VDS = 320 V, ID = 10 A,
VGS = 10 V)
SOURCE–DRAIN DIODE CHARACTERISTICS
Forward On–Voltage
Forward Turn–On Time
Reverse Recovery Time
(IS = 10 A, di/dt = 100 A/µs)
INTERNAL PACKAGE INDUCTANCE
Internal Drain Inductance
(Measured from the contact screw on tab to center of die)
(Measured from the drain lead 0.25″ from package to center of die)
V(BR)DSS
400
—
—
Vdc
IDSS
mAdc
—
—
0.25
—
—
1.0
IGSSF
—
—
100
nAdc
IGSSR
—
—
100
nAdc
VGS(th)
Vdc
2.0
—
4.0
1.5
—
3.5
RDS(on)
—
0.4
0.55 Ohms
VDS(on)
—
—
Vdc
—
6.0
—
4.75
gFS
4.0
—
—
mhos
Ciss
Coss
Crss
—
1570
—
pF
—
230
—
—
55
—
td(on)
tr
td(off)
tf
Qg
Qgs
Qgd
—
25
—
ns
—
37
—
—
75
—
—
31
—
—
46
63
nC
—
10
—
—
23
—
VSD
ton
trr
—
—
2.0
Vdc
—
**
—
ns
—
250
—
Ld
nH
—
3.5
—
—
4.5
—
Internal Source Inductance
Ls
(Measured from the source lead 0.25″ from package to source bond pad)
—
7.5
—
nH
* Pulse Test: Pulse Width = 300 µs, Duty Cycle ≤ 2.0%.
** Limited by circuit inductance.
2
Motorola TMOS Power MOSFET Transistor Device Data