DTA143TM3 查看數據表（PDF） - ON Semiconductor
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DTA143TM3 Datasheet PDF : 12 Pages
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SCALE 2:1
SC−59
CASE 318D−04
ISSUE H
DATE 28 JUN 2012
D
3
HE
1
E
2
b
e
A
C
A1
L
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
2.4
0.094
1.0
0.039
0.8
0.031
ǒ Ǔ SCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
MILLIMETERS
DIM MIN NOM MAX
A 1.00
1.15
1.30
A1 0.01
0.06
0.10
b
0.35
0.43
0.50
c
0.09
0.14
0.18
D 2.70
2.90
3.10
E 1.30
1.50
1.70
e
1.70
1.90
2.10
L 0.20
0.40
0.60
H E 2.50
2.80
3.00
MIN
0.039
0.001
0.014
0.003
0.106
0.051
0.067
0.008
0.099
INCHES
NOM
0.045
0.002
0.017
0.005
0.114
0.059
0.075
0.016
0.110
MAX
0.051
0.004
0.020
0.007
0.122
0.067
0.083
0.024
0.118
GENERIC
MARKING DIAGRAM
XXX MG
G
1
XXX
M
G
= Specific Device Code
= Date Code
= Pb−Free Package*
(*Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
STYLE 1:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
STYLE 2:
PIN 1. ANODE
2. N.C.
3. CATHODE
STYLE 3:
PIN 1. ANODE
2. ANODE
3. CATHODE
STYLE 4:
PIN 1. CATHODE
2. N.C.
3. ANODE
STYLE 5:
PIN 1. CATHODE
2. CATHODE
3. ANODE
STYLE 6:
PIN 1. ANODE
2. CATHODE
3. ANODE/CATHODE
DOCUMENT NUMBER: 98ASB42664B
DESCRIPTION: SC−59
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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