CXK5B16120TM-12 查看數據表（PDF） - Sony Semiconductor

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CXK5B16120TM-12

65536-word × 16-bit High Speed Bi-CMOS Static RAM

Sony Semiconductor 

Package Outline

Unit: mm

CXK5B16120J

44

44PIN SOJ (PLASTIC) 400mil

+ 0.4

28.58 – 0.1

23

R0.254 1

+ 0.08

0.73 – 0.07

22

1.27

+ 0.075

0.43 – 0.045

0.178 M

1.15 MAX

+ 0.2

2.2 – 0.11

0.1

CXK5B16120J/TM

SONY CODE

EIAJ CODE

JEDEC CODE

SOJ-44P-01

∗SOJ044-P-0400-A

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE WEIGHT

EPOXY RESIN

SOLDER PLATING

COPPER ALLOY

1.9g

CXK5B16120TM

44PIN TSOP (II) (PLASTIC) 400mil

∗18.41 ± 0.1

44

23

1.2 MAX

0.1

A

1

0.8

B

22

0.3 ± 0.1

0.13 M

+ 0.05

0.125 – 0.02

+ 0.1

0.1 – 0.05

0.32 ± 0.08

(0.3)

DETAIL B

0° to 10°

DETAIL A

NOTE: Dimension “∗” does not include mold protrusion.

SONY CODE

EIAJ CODE

JEDEC CODE

TSOP (II) -44P-L01

TSOP (II) 044-P-0400-A

PACKAGE STRUCTURE

MOLDING COMPOUND EPOXY / PHENOL RESIN

LEAD TREATMENT

SOLDER PLATING

LEAD MATERIAL

42 ALLOY

PACKAGE WEIGHT

0.5g

– 10 –

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