NCP1207A(2004) 查看數據表（PDF） - ON Semiconductor
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NCP1207A
(Rev.:2004)
(Rev.:2004)
ON Semiconductor
NCP1207A Datasheet PDF : 16 Pages
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NCP1207A
HV
7.0
mA
VCC
PON
+−
+
12 V, 10 V,
5.3 V (fault)
VUVLO
4.5 ms
Delay
+
−
+
OVP
Demag
+
5.0 V
/1.44
−+
8.0 ms
Blanking
SQ
S*
R* R Q
−
+
+
50 mV
Resd
Rint
10 V
Driver: src = 20
VCC sink = 10
Demag
Drv
4.2 V
GND
To Internal
Supply
Fault
Mngt.
Overload?
Soft−Start = 1 ms
+
/3
FB
−
1.0 V 200 mA
when Drv
is OFF
*S and R are level triggered whereas S is edge
triggered. R has priority over the other inputs.
5.0 ms
Timeout
Timeout
Reset
380 ns
L.E.B.
CS
Demag
ÁÁÁÁÁÁMAÁÁÁXIMÁÁÁUMÁÁÁRATÁÁÁINGÁÁÁS ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁFRiÁÁÁgautirnÁÁÁeg2.ÁÁÁInteÁÁÁrnaÁÁÁl CiÁÁÁrcuiÁÁÁt ArÁÁÁchitÁÁÁectÁÁÁureÁÁÁÁÁÁÁÁÁÁÁÁSymÁÁÁbolÁÁÁÁÁÁVaÁÁlÁue ÁÁÁÁÁÁUniÁÁtÁs
Power Supply Voltage
VCC, Drv
16
V
Maximum Voltage on all other pins except Pin 8 (HV), Pin 6 (VCC) Pin 5 (Drv) and Pin 1 (Demag)
−
−0.3 to 10
V
Maximum Current into all pins except VCC (6), HV (8) and Demag (1) when 10 V ESD diodes are
−
5.0
mA
activated
Maximum Current in Pin 1
Idem +3.0/−2.0 mA
Thermal Resistance, Junction−to−Case
RqJC
57
°C/W
Thermal Resistance, Junction−to−Air, SOIC version
RqJA
178
°C/W
Thermal Resistance, Junction−to−Air, DIP8 version
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Operating Junction Temperature
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Maximum Junction Temperature
RqJA
TJ
TJMAX
100
−40 to +125
150
°C/W
°C
°C
Temperature Shutdown
−
155
°C
Hysteresis in Shutdown
−
30
°C
Storage Temperature Range
−
−60 to +150 °C
ESD Capability, HBM Model (All pins except HV)
−
2.0
kV
ESD Capability, Machine Model
−
200
V
Maximum Voltage on Pin 8 (HV), Pin 6 (VCC) decoupled to ground with 10 mF
VHVMAX
500
V
Minimum Voltage on Pin 8 (HV), Pin 6 (VCC) decoupled to ground with 10 mF
VHVMIN
40
V
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
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