NCP382
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
From IN to OUT1, From IN to OUT2 Supply Voltage (Note 1)
VIN , VOUT1,VOUT2
−7.0 to +7.0
V
IN, OUT1,OUT2, EN1, EN2, FLAG1, FLAG2 (Note 1)
VIN, VOUT1, VOUT2, VEN1, VEN2,
−0.3 to +7.0
V
VFLAG1, VFLAG2
FLAG1, FLAG2 sink current
ISINK
1.0
mA
ESD Withstand Voltage (IEC 61000−4−2) (output only, when
bypassed with 1.0 mF capacitor minimum)
ESD IEC
15 Air, 8 contact
kV
Human Body Model (HBM) ESD Rating are (Note 2)
ESD HBM
2000
V
Machine Model (MM) ESD Rating are (Note 2)
ESD MM
200
V
Latch−up protection (Note 3)
− Pins IN, OUT1, OUT2, FLAG1, FLAG2
− EN1, EN2
LU
mA
100
Maximum Junction Temperature (Note 4)
TJ
−40 to + TSD
°C
Storage Temperature Range
TSTG
−40 to + 150
°C
Moisture Sensitivity (Note 5)
MSL
Level 1
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. According to JEDEC standard JESD22−A108.
2. This device series contains ESD protection and passes the following tests:
Human Body Model (HBM) +/−2.0 kV per JEDEC standard: JESD22−A114 for all pins.
Machine Model (MM) +/−200 V per JEDEC standard: JESD22−A115 for all pins.
3. Latch up Current Maximum Rating: $100 mA per JEDEC standard: JESD78 class II.
4. A thermal shutdown protection avoids irreversible damage on the device due to power dissipation.
5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020.
OPERATING CONDITIONS
Symbol
Parameter
Conditions
Min Typ Max Unit
VIN
VENX
TA
ISINK
CIN
COUTX
RqJA
Operational Power Supply
Enable Voltage
Ambient Temperature Range
FLAG sink current
Decoupling input capacitor
Decoupling output capacitor
Thermal Resistance Junction−to−Air
USB port per Hub
DFN−8 package (Notes 6 and 7)
SOIC−8 package (Notes 6 and 7)
2.5
5.5
V
0
5.5
−40 25
+85
°C
1
mA
1
mF
120
mF
140
°C/W
210
°C/W
TJ
IOUTX
Junction Temperature Range
Recommended Maximum DC
current
DFN−8 package
SOIC−8 package
−40 25 +125
°C
2
A
1.5
A
PD
Power Dissipation Rating (Note 8)
TA v 25°C
DFN−8 package
850
mW
SOIC−8 package
570
mW
TA = 85°C
DFN−8 package
428
mW
SOIC−8 package
285
mW
6. A thermal shutdown protection avoids irreversible damage on the device due to power dissipation.
7. The RqJA is dependent of the PCB heat dissipation. Announced thermal resistance is the unless PCB dissipation and can be improve with
final PCB layout.
8.
The maximum
power
dissipation
(PD)
is
given
by
the
following
formula:
PD
+
TJMAX * TA
RqJA
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