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NCP4632(2017) 查看數據表(PDF) - ON Semiconductor

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NCP4632 Datasheet PDF : 14 Pages
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NCP4632
VIN
VOUT
VIN
SENSE/ADJ
Vref
Vref
Current Limit
CE
Thermal Protection
Current Limit
CE
Thermal Protection
Reverse Detector
NCP4632B
GND
Reverse Detector
NCP4632D
Figure 2. Simplified Schematic Block Diagram
VOUT
SENSE/
ADJ
GND
PIN FUNCTION DESCRIPTION
Pin No.
TO252−5−P2
Pin Name
Description
4
VOUT
Output Voltage Pin
2
VIN
Input Voltage Pin
3
GND (Note 1) Ground Pin
1
CE
Chip Enable Pin, Active “H”, Connect to VIN pin if not used.
5
SENSE / ADJ Sense Pin on Fixed Options, ADJ for Adjustable
1. TAB is internally connected to pin 3 GND.
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Input Voltage
VIN
6.0
V
Output Voltage
VOUT
−0.3 to VIN + 0.3
V
Chip Enable Input
VCE
−0.3 to 6.0
V
Sense Input
Vsense
−0.3 to 6.0
V
Output Current
IOUT
3000
mA
Power Dissipation (Note 2)
PD(MAX)
3800
mW
Storage Temperature Range
TSTG
−55 to 125
°C
Maximum Junction Temperature
TJ(MAX)
125
°C
ESD Capability, Human Body Model (Note 3)
ESDHBM
2000
V
ESD Capability, Machine Model (Note 3)
ESDMM
200
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
2. JEDEC standard 76.2mm x 114.3 mm, FR4 Four−layers board
3. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
THERMAL CHARACTERISTICS
Rating
Thermal Characteristics, DPAK−5
Thermal Resistance, Junction−to−Air
Symbol
RqJA
Value
53
Unit
°C/W
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