NCV47701(2012) 查看數據表（PDF） - ON Semiconductor

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NCV47701
(Rev.:2012)

5 V to 20 V Adjustable Low Dropout Regulator with Adjustable Current Limit

ON Semiconductor 

NCV47701

ABSOLUTE MAXIMUM RATINGS (Note 1)

Rating

Symbol

Min

Max

Unit

Input Voltage

Vin

−42

45

V

Enable Input Voltage

VEN

−42

45

V

Adjustable Input Voltage

VADJ

−0.3

10

V

CSO Voltage

VCSO

−0.3

7

V

Output Voltage

Vout

−1

40

V

Junction Temperature

TJ

−40

150

°C

Storage Temperature

TSTG

−55

150

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.

ESD CAPABILITY (Note 2)

Rating

Symbol

Min

Max

Unit

ESD Capability, Human Body Model

ESDHBM

ESD Capability, Machine Model

ESDMM

2. This device series incorporates ESD protection and is tested by the following methods:

ESD Human Body Model tested per AEC−Q100−002 (JS−001−2010)

ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)

−2

−200

2

kV

200

V

LEAD SOLDERING TEMPERATURE AND MSL (Note 3)

Rating

Symbol

Min

Max

Unit

Moisture Sensitivity Level

SOIC−8 EP

MSL

2

−

SOIC−8

1

Lead Temperature Soldering, Reflow (SMD Styles Only), Pb−Free Versions

TSLD

−

265 peak

°C

3. For more information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D

THERMAL CHARACTERISTICS (Note 4)

Rating

Symbol

Value

Unit

Thermal Characteristics, SOIC−8 EP (single layer PCB)

Thermal Resistance, Junction−to−Air (Note 5)

Thermal Reference, Junction−to−Lead (Note 5)

RθJA

RψJL

°C/W

70

19

Thermal Characteristics, SOIC−8 EP (4 layers PCB)

Thermal Resistance, Junction−to−Air (Note 5)

Thermal Reference, Junction−to−Lead (Note 5)

RθJA

RψJL

°C/W

29

12

Thermal Characteristics, SOIC−8 (single layer PCB)

Thermal Resistance, Junction−to−Air (Note 5)

Thermal Reference, Junction−to−Lead (Note 5)

RθJA

RψJL

°C/W

121

42

Thermal Characteristics, SOIC−8 (4 layers PCB)

Thermal Resistance, Junction−to−Air (Note 5)

Thermal Reference, Junction−to−Lead (Note 5)

RθJA

RψJL

°C/W

77

52

4. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.

5. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate. Single layer − according to JEDEC51.3,

4 layers − according to JEDEC51.7.

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