NCV47711PDAJR2G(2012) 查看數據表（PDF） - ON Semiconductor
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NCV47711PDAJR2G
(Rev.:2012)
(Rev.:2012)
ON Semiconductor
NCV47711PDAJR2G Datasheet PDF : 11 Pages
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NCV47711
PACKAGE DIMENSIONS
D
A
8
2X
0.10 C A-B
D
5
EXPOSED
PAD
SOIC−8 EP
CASE 751AC−01
ISSUE B
F
5
8
2X
E1 ÉÉÉÉ
0.10 C D
1
PIN ONE
LOCATION
e
B
E
2X
4
0.20 C
8X b
0.25 C A-B D
G
4
1
BOTTOM VIEW
TOP VIEW
0.10 C
8X
0.10 C
SEATING
PLANE
C
A
A2
SIDE VIEW
A1
H
GAUGE
PLANE
0.25
L
q
(L1)
DETAIL A
DETAIL A
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS (ANGLES
IN DEGREES).
3. DIMENSION b DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE
0.08 MM TOTAL IN EXCESS OF THE “b”
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
4. DATUMS A AND B TO BE DETERMINED
AT DATUM PLANE H.
h
AA
END VIEW
b1ÉÉÉÉÇÇcÉÉÉÉÇÇ(b)
c1
MILLIMETERS
DIM MIN MAX
A 1.35 1.75
A1 0.00 0.10
A2 1.35 1.65
b 0.31 0.51
b1 0.28 0.48
c 0.17 0.25
c1 0.17 0.23
D
4.90 BSC
E
6.00 BSC
E1 3.90 BSC
e
1.27 BSC
L 0.40 1.27
L1 1.04 REF
F 2.24 3.20
G 1.55 2.51
h 0.25 0.50
q
0 _ 8_
SECTION A−A
SOLDERING FOOTPRINT
2.72
0.107
1.52
0.060
Exposed
Pad
7.0 2.03
0.275 0.08
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
ǒ mm Ǔ
inches
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NCV47711/D
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