NCV8184DG 查看數據表（PDF） - ON Semiconductor

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NCV8184DG

Micropower 70 mA Low Dropout Tracking Regulator/Line Driver

ON Semiconductor 

NCV8184

PACKAGE THERMAL DATA

Parameter

SOIC−8 Package

Junction−to−Case top (Y−JT, YJT)

Junction−to−Pin 8 (Y−JL8, YJL8)

Junction−to−Ambient (RqJA, qJA)

DPAK 5−Pin Package

Junction−to−Board (Y−JB, YJB)

Junction−to−Pin 3 (tab) (Y−JL3, YJL3)

Junction−to−Ambient (RqJA, qJA)

Test Conditions

Typical Value

Min−Pad Board (Figure 24)

1.0 in Pad Board (Figure 25)

39

32

63

58

121

0.5 in2 Spreader Board (Figure 26)

98

1.0 in2 Spreader Board (Figure 27)

15

15

16

16

100

69

Units

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

Figure 24. 2.0 oz. copper, 40 mil traces

Figure 25. 1.0 oz. copper,

approx. 1/8 in2 per lead, 1.0 in2 total

Figure 26. 1.0 oz. copper, 0.3 in2 drain pad,

0.5 in2 including traces

Figure 27. 2.0 oz. copper, 0.5 in2 drain

pad, 1.0 in2 including traces

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