AMIS-30521 查看數據表（PDF） - ON Semiconductor

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AMIS-30521

Micro-Stepping Motor Driver

ON Semiconductor 

AMIS−30521, NCV70521

PACKAGE THERMAL CHARACTERISTICS

The AMIS−30521/NCV70521 is available in an

The Rthja for 2S2P is simulated conform JEDEC JESD−51

NQFP−32 package. For cooling optimizations, the NQFP as follows:

has an exposed thermal pad which has to be soldered to the • A 4−layer printed circuit board with inner power planes

PCB ground plane. The ground plane needs thermal vias to

and outer (top and bottom) signal layers is used

conduct the heat to the bottom layer. Figure 3 gives an

example for good power distribution solutions.

For precise thermal cooling calculations the major

thermal resistances of the device are given. The thermal

media to which the power of the devices has to be given are:

• Static environmental air (via the case)

• Board thickness is 1.46 mm (FR4 PCB material)

• The 2 signal layers: 70 mm thick copper with an area of

5500 mm2 copper and 20% conductivity

• The 2 power internal planes: 36 mm thick copper with

an area of 5500 mm2 copper and 90% conductivity

• PCB board copper area (via the exposed pad)

The thermal resistances are presented in Table 5: DC

Parameters.

The Rthja for 1S0P is simulated conform JEDEC JESD−51

as follows:

• A 1−layer printed circuit board with only 1 layer

The major thermal resistances of the device are the Rth • Board thickness is 1.46 mm (FR4 PCB material)

from the junction to the ambient (Rthja) and the overall Rth

• The layer has a thickness of 70 mm copper with an area

from the junction to exposed pad (Rthjp). In Table 3 one can

of 5500 mm2 copper and 20% conductivity

find the values for the Rthja simulated according to

JESD−51.

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎNÎÎÎÎÎÎÎÎÎQFPÎÎÎÎÎÎÎÎÎ−32ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Figure 3. Example of NQFP−32 PCB Ground Plane Layout in Top View (Preferred Layout at Top and Bottom)

ELECTRICAL SPECIFICATION

Recommended Operation Conditions

Operating ranges define the limits for functional

operation and parametric characteristics of the device. Note

that the functionality of the chip outside these operating

ranges is not guaranteed. Operating outside the

recommended operating ranges for extended periods of time

may affect device reliability.

Table 4. OPERATING RANGES

Symbol

Parameter

VBB

Analog DC supply

VDD

Logic supply voltage

TJ

Junction temperature

5. No more than 100 cumulative hours in life time above Ttw

Min

Max

Unit

+6

+30

V

4.75

5.25

V

−40

+172 (Note 5)

°C

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