NDT454 查看數據表（PDF） - Fairchild Semiconductor
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NDT454 Datasheet PDF : 6 Pages
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Typical Electrical and ThermalCharacteristics (continued)
20
V DS = -15V
16
12
8
TJ= -55°C
25°C
125°C
4
0
0
-5
-10
-15
-20
ID , DRAIN CURRENT (A)
3.5
3
2.5
2
1.5
1b
1c
1
0.5
0
1a
4.5"x5" FR-4 Board
TA = 25o C
Still Air
0.2
0.4
0.6
0.8
1
2oz COPPER MOUNTING PAD AREA (in 2 )
Figure 13. Transconductance Variation with Drain
Current and Temperature.
Figure 14. SOT-223 Maximum Steady-State Power
Dissipation versus Copper Mounting Pad
Area.
7
6
1a
5
4
1b
1c
3
2
0
4.5"x5" FR-4 Board
TA = 25 oC
Still Air
VGS = -10V
0.2
0.4
0.6
0.8
1
2oz COPPER MOUNTING PAD AREA (in 2 )
Figure 15. Maximum Steady-State Drain
Current versus Copper Mounting Pad
Area.
30
10
RDS(ON) LIMIT
3
1
0.3
0.1
0.03
VGS = -10V
SINGLE PULSE
R θJ A = See Note 1c
TA = 25°C
100u
1ms
s
10ms
100ms
1s
D1C0 s
0.01
0.1 0.2
0.5
1
2
5
10
- VDS , DRAIN-SOURCE VOLTAGE (V)
30 50
Figure 16. Maximum Safe Operating Area.
1
0.5
D = 0.5
0.2
0.1
0.05
0.2
0.1
0.05
0.02
0.01
0.005
0.002
0.001
0.0001
0.02
0.01
Single Pulse
0.001
0.01
0.1
1
t 1 , TIME (sec)
R θJA (t) = r(t) * R θJA
R θJA = See Note 1 c
P(pk)
t1
t2
TJ - TA = P * R θJA (t)
Duty Cycle, D = t1 / t2
10
100
300
Figure 15. Transient Thermal Response Curve.
Note: Thermal characterization performed using the conditions described in note 1c. Transient thermal response will change
depending on the circuit board design.
NDT454P Rev. D2
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