NLAS3699 查看數據表（PDF） - ON Semiconductor
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NLAS3699 Datasheet PDF : 11 Pages
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
1
SCALE 2:1
QFN16 3x3, 0.5P
CASE 485AE
ISSUE C
DATE 24 JUN 2016
PIN 1
LOCATION
D
ÇÇÇÇÇÇ
A
L
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
B
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
L1
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
DETAIL A
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
ALTERNATE TERMINAL
PAD AS WELL AS THE TERMINALS.
E
CONSTRUCTIONS
5. OUTLINE MEETS JEDEC DIMENSIONS PER
MO−220, VARIATION VEED−6.
MILLIMETERS
0.15 C
0.15 C
0.10 C
TOP VIEW
DETAIL B (A3)
0.08 C
NOTE 4
SIDE VIEW
A1
D2
16X L
DETAIL A
5
8
A3
ÉÉÉÉÉÉ ÉÉÇÉÉÇ EXPOSEDCu
MOLD CMPD
A1
DETAIL B
A
ALTERNATE
CONSTRUCTIONS
C
SEATING
PLANE
DIM MIN MAX
A 0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b 0.18 0.30
D
3.00 BSC
D2 1.25 1.55
E
3.00 BSC
E2 1.25 1.55
e
0.50 BSC
K 0.20 −−−
L 0.30 0.50
L1 0.00 0.15
GENERIC
MARKING DIAGRAM*
XXXXX
XXXXX
4
9
ALYWG
G
16X K
E2
A = Assembly Location
1
12
L = Wafer Lot
Y = Year
16
13
16X b
0.10 C A B
e
0.05 C NOTE 3
e/2
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
3.30
1.55
16X
0.65
W = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
1
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
1.55 3.30
16X
0.30
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER: 98AON14949D
DESCRIPTION: QFN16 3X3, 0.5P
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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