OM4068 查看數據表（PDF） - Philips Electronics

零件编号

产品描述 (功能)

生产厂家

OM4068

LCD driver for low multiplex rates

Philips Electronics 

Philips Semiconductors

LCD driver for low multiplex rates

Product specification

OM4068

FEATURES

• Single-chip LCD controller/driver

• Static/duplex/triplex drive modes with up to

32/64/96 LCD segments drive capability per device

• Selectable backplane drive configuration: static or

2 or 3 backplane multiplexing

• Selectable display bias configuration drive: static, 1⁄2 or

1⁄3

• 32 segment drivers

• Serial data input (word length 32 to 96 bits)

• On-chip generation of intermediate LCD bias voltages

• 2 MHz fast serial bus interface

• CMOS compatible

• Compatible with any 4-bit, 8-bit or 16-bit

microprocessors/microcontrollers

• May be cascaded for large LCD applications

• Logic supply voltage range (VDD − VSS) of 2.5 to 5.5 V

• Display supply voltage range (VLCD − VSS) of

3.5 to 6.5 V

• Low power consumption, suitable for battery operated

systems

• No external components needed by the oscillator

• Manufactured in silicon gate CMOS process.

APPLICATIONS

• Telecom equipment

• Portable instruments

• Alarm systems

• Automotive equipment.

GENERAL DESCRIPTION

The OM4068 is a low-power CMOS LCD driver, designed

to drive Liquid Crystal Displays (LCDs) with low multiplex

rates. It generates the drive signals for any static or

multiplexed LCD containing up to three backplanes and up

to 32 segment lines and can be easily cascaded for larger

LCD applications. All necessary functions for the display

are provided in a single chip, including on-chip generation

of LCD bias voltages, resulting in a minimum of external

components and lower power consumption. A 3-line bus

structure enables serial data transfer with most

microprocessors/microcontrollers. All inputs are CMOS

compatible.

ORDERING INFORMATION

TYPE NUMBER

OM4068H(1)

OM4068P

OM4068U/5(2)

OM4068U

NAME

QFP44

DIP40

die

tray

PACKAGE

DESCRIPTION

plastic quad flat package; 44 leads (lead length 1.3 mm);

body 10 × 10 × 1.75 mm

plastic dual in-line package; 40 leads (600 mil)

unsawn wafer

chip in tray

Notes

1. Gull Wing package.

2. For details see Chapter “Bonding pad locations”.

VERSION

SOT307-2

SOT129-1

−

−

1998 Jun 18

2

Share Link: