OM2070B 查看數據表（PDF） - Philips Electronics
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OM2070B Datasheet PDF : 7 Pages
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Philips Semiconductors
Wideband amplifier module
Product specification
OM2070B
MOUNTING
The module should preferably be mounted on a
double-sided printed-circuit board, see Fig.3.
Input and output should be connected to 75 Ω tracks.
The connection to the common pins should be as close to
the seating plane as possible.
SOLDERING
Hand soldering
The maximum contact time for a soldering iron
temperature of 260 °C up to the seating plane is 5 s.
Dip or wave soldering
The maximum permissible temperature for the solder is
260 °C. It must not be in contact with the joint for more than
5 s.
The total contact time of successive solder waves must not
exceed 5 s.
The device may be mounted against the printed-circuit
board, but the temperature of the device must not exceed
125 °C.
If the printed-circuit board has been pre-heated, forced
cooling may be necessary immediately after soldering to
keep the temperature below the allowable limit.
PACKAGE OUTLINE
handbook, full pagewidth
27 max
pin 1 identification
5
max
Dimensions in mm.
21 max
1
9
3 max
4.5
8 7654 321
3.0
0.5
2.54
(9x)
MLA417
0.25
Fig.6 Resin coated encapsulation.
1995 Nov 29
6
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