WS1M32-100G3CA 查看數據表（PDF） - White Electronic Designs => Micro Semi

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WS1M32-100G3CA

1M x 32 SRAM MODULE

White Electronic Designs => Micro Semi 

WS1M32-XG3X

1Mx32 SRAM MODULE PRELIMINARY*

FEATURES

s Access Time of 70, 85, 100, 120ns

s 84 lead, 28mm CQFP, (Package 511)

s Organized as two banks of 512Kx32, User Configurable as

1Mx16 or 2Mx8

s Commercial, Industrial and Military Temperature Ranges

s TTL Compatible Inputs and Outputs

s 5 Volt Power Supply

s Low Power CMOS

s Weight - 20 grams typical

* This data sheet describes a product under development, not fully

characterized, and is subject to change without notice.

PIN CONFIGURATION FOR WS1M32-XG3X

TOP VIEW

PIN DESCRIPTION

I/O0-31 Data Inputs/Outputs

11 10 9 8 7 6 5 4 3 2 1 84 83 82 81 80 79 78 77 76 75

A0-18 Address Inputs

4

WE1-4 Write Enables

VCC

A0

A1

A2

A3

A4

A5

A6

OE1

OE2

OE3

OE4

NC

A7

A8

A9

A10

A11

A12

A13

GND

12

74

13

73

14

72

15

71

16

70

17

69

18

68

19

67

20

66

21

65

22

64

23

63

24

62

25

61

26

60

27

59

28

58

29

57

30

56

31

55

32

54

33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53

GND

CS1-2

Chip Selects

NC

NC

OE1-4 Output Enables

NC

NC

VCC

Power Supply

NC

GND

Ground

NC

NC

NC

Not Connected

NC

WE4

WE3

WE2

BLOCK DIAGRAM

WE1

NC

OE1 WE1

OE2 WE2

OE3 WE3

OE4 WE4

NC

A18

A17

CS1

A16

A0-18

A15

A14

VCC

5122KMxx88

5122KMxx88

5122KMxx88

512K x 8

512K x 8

512K x 8

5122MK x 8

512K x 8

8

CS2

I/O0-7

8

I/O8-15

8

I/O16-23

8

I/O24-31

NOTE: CS1& CS2 are used as bank select

The White 84 lead G3 CQFP fills

the same fit and function as the

JEDEC 84 lead CQFJ or 84 PLCC.

But the G3 has the TCE and lead

inspection advantage of the

CQFP form.

1.146"

May 2001 Rev. 2

1

White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com

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