PA1162 查看數據表（PDF） - M/A-COM Technology Solutions, Inc.
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PA1162 Datasheet PDF : 2 Pages
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PA1162
RF Linear Hybrid Power Amplifier - 4 Watts
800 to 960 MHz
Rev. V4
Typical Performance Curves at +25°C
GAIN
29.0
28.0
Outline Drawing: Flange Mount Carrier *
M/A-COM
27.0
800
820
840
860
880
900
920
940
960
FREQUENCY - MHZ
VSWR
2.0
I nput V SWR
Out put V SWR
1.5
1.0
800 820 840 860 880 900 920 940 960
FREQUENCY - MHZ
NOISE FIGURE
2.2
2.0
* DIMENSIONS ARE IN INCHES
WEIGHT: 18.8 grams (0.67 oz.) max
Recommended Mounting Notes:
1.) Since the PA1162 is a high frequency design, it is important that a very
good electrical ground exists and that low loss transmission lines connecting
the RF terminals have a 50 ohm characteristic impedance. For example: for
0.062” thick G-10 fiberglass PCB material (1oz clad, both sides), a 50 ohm
line microstrip is 0.100 inches wide.
1.8
800 820 840 860 880 900 920 940 960
FREQUENCY - MHz
POWER OUTPUT*
36.0
35.0
34.0
800 820 840 860 880 900 920 940 960
FREQUENCY - MHz
* @ 1.0 dB Gain Compression
THIRD ORDER INTERCEPT POINT *
51.0
50.0
49.0
800 820 840 860 880 900 920 940 960
FREQUENCY - MHz
* Output Pow er = +15 dBm
2.) For the PWB, It is advisable to provide sufficient plated ground through
holes for good transfer of the electrical ground plane from front to back to the
PCB. The ground vias also serve as good thermal conductors to dissipate
the heat generated by the PA module. For the DC transmission line portion,
It is a good practice to add external bypass capacitors with >/= 0.1 uF, to
prevent any RF feedback from circulating on the DC lines.
3.) The specified flatness over the entire length of the bottom surface of the
PA1162 flange is within .0015”. The cavity of the subsystem baseplate
should be machined to a similar overall flatness so as to not cause any po-
tential grounding discontinuities. Thermal grease can be used as an inter-
face between the PA and subsystem floor to optimize the heat transfer effi-
ciency. The baseplate needs to provide sufficient heatsinking for the PA
module to operate normally.
4.) All interfacing RF, bias, and ground pins are an edge clip design on the
side soldered onto the PWB of the PA1162. The pins are both mechanically
and solder attached above and below the board. So they will be structurally
held in place, even if the solder connection reflows. It is advisable that SN63
solder be used to spot reflow the pins to the mating circuit board.
5.) To avoid any chance of impedance mismatch on the RF interface connec-
tions, it is advisable to mount the PA module as close as possible against the
side of the circuit board, to avoid any air gaps which could introduce un-
wanted parasitic effects.
6.) Based on the outline dimensions of the PA module, the depth of the cavity
along side the subsystem PWB, should be enough so that when the module
is mounted in place, there should be a ~ .003” gap between the top side of
the circuit board trace and the bottom side of the mating pin.
2
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
• India Tel: +91.80.4155721
• China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
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