PCA8575 查看數據表（PDF） - Philips Electronics
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PCA8575 Datasheet PDF : 30 Pages
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NXP Semiconductors
PCA8575
Remote 16-bit I/O expander for I2C-bus with interrupt
6.2 Pin description
Table 2.
Symbol
INT
AD1
AD2
P00
P01
P02
P03
P04
P05
P06
P07
VSS
P10
P11
P12
P13
P14
P15
P16
P17
AD0
SCL
SDA
VDD
Pin description
Pin
Description
SO24, SSOP24,
HVQFN24
TSSOP24, DHVQFN24
1
22
interrupt output (active LOW)
2
23
address input 1
3
24
address input 2
4
1
quasi-bidirectional I/O 00
5
2
quasi-bidirectional I/O 01
6
3
quasi-bidirectional I/O 02
7
4
quasi-bidirectional I/O 03
8
5
quasi-bidirectional I/O 04
9
6
quasi-bidirectional I/O 05
10
7
quasi-bidirectional I/O 06
11
8
quasi-bidirectional I/O 07
12[1]
9[1]
supply ground
13
10
quasi-bidirectional I/O 10
14
11
quasi-bidirectional I/O 11
15
12
quasi-bidirectional I/O 12
16
13
quasi-bidirectional I/O 13
17
14
quasi-bidirectional I/O 14
18
15
quasi-bidirectional I/O 15
19
16
quasi-bidirectional I/O 16
20
17
quasi-bidirectional I/O 17
21
18
address input 0
22
19
serial clock line input
23
20
serial data line input/output
24
21
supply voltage
[1] HVQFN and DHVQFN package die supply ground is connected to both the VSS pin and the exposed center
pad. The VSS pin must be connected to supply ground for proper device operation. For enhanced thermal,
electrical, and board-level performance, the exposed pad needs to be soldered to the board using a
corresponding thermal pad on the board, and for proper heat conduction through the board thermal vias
need to be incorporated in the PCB in the thermal pad region.
PCA8575_1
Objective data sheet
Rev. 01 — 30 November 2006
© NXP B.V. 2006. All rights reserved.
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