CXA1875AP 查看數據表（PDF） - Sony Semiconductor
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CXA1875AP Datasheet PDF : 10 Pages
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Package Outline Unit : mm
CXA1875AP
16PIN DIP (PLASTIC)
+ 0.4
19.2 – 0.1
16
9
1
8
2.54
0° to 15°
CXA1875AP/AM
CXA1875AM
0.5 ± 0.1
1.2 ± 0.15
Two kinds of package surface:
1.All mat surface type.
2.All mirror surface type.
SONY CODE
EIAJ CODE
JEDEC CODE
DIP-16P-01
DIP016-P-0300
Similar to MO-001-AE
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
SOLDER PLATING
COPPER ALLOY
1.0 g
16PIN SOP (PLASTIC)
+ 0.4
9.9 – 0.1
16
9
+ 0.4
1.85 – 0.15
0.15
+ 0.2
0.1 – 0.05
1
0.45 ± 0.1
8
1.27
+ 0.1
0.2 – 0.05
0.24 M
SONY CODE
EIAJ CODE
JEDEC CODE
SOP-16P-L01
SOP016-P-0300
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
SOLDER PLATING
COPPER ALLOY
0.2g
Purchase of Sony’s I2C components conveys a license under the Philips I2C Patent Rights to use these components in an I2C
system, provided that the system conforms to the I2C Standard Specifications as defined by Philips.
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